Assignee
SARAS MICRO DEVICES INC
US·9 granted patents·13 pending applications·0 citations·filing 2021–2025
Top patents by PatentIndex Score
22 records- 0176US12400940B1Lead frame device with shared terminalSARAS MICRO DEVICES INC·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 0276US12185469B1Lead frame and method for stacking discrete components to be embedded in semiconductor deviceSARAS MICRO DEVICES INC·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 0373US2026060099A1Lead frame device with shared terminalSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0472US2026068056A1Lead frame and method for stacking discrete components to be embedded in semiconductor deviceSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0570US12347628B1Stackable and embeddable vertical capacitors in semiconductor devices and method of fabricationSARAS MICRO DEVICES INC·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0670US12183692B1Embedded inductors and integrated voltage regulators for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 0770US12154940B1Stacked staggered electrode foil capacitor structures in semiconductor devices for single and multi-voltage domain applications and method of fabricationSARAS MICRO DEVICES INC·Filed 2024·Granted Nov 26, 2024·0 cites·18 claims
- 0869US12573537B2Embeddable coupled inductors for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Granted Mar 10, 2026·0 cites·21 claims
- 0969US2025226337A1Embedded inductors and integrated voltage regulators for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1068US12191346B1Selective area metal process for improved metallurgical bonding of aluminum to copper for integrated passive devices in a semiconductor deviceSARAS MICRO DEVICES INC·Filed 2024·Granted Jan 7, 2025·0 cites·20 claims
- 1168US2025267881A1Method of fabricating stacked staggered electrode foil capacitor structures in semiconductor devices for single and multi-voltage domain applicationsSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1267US2025359088A1Selective area metal process for improved metallurgical bonding of aluminum to copper for integrated passive devices in a semiconductor deviceSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1365US2025385034A1Embeddable coupled inductors for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1459US2025357052A1Electrolytic capacitor for a semiconductor device having improved conductive polymer layerSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1558US2026068188A1Stackable and embeddable vertical capacitors in semiconductor devices and method of fabricationSARAS MICRO DEVICES INC·Filed 2025·Application pending·0 cites
- 1657US12136601B1Single-sided embeddable capacitors for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Granted Nov 5, 2024·0 cites·20 claims
- 1757US2025226298A1Embeddable tiles containing passive devices for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1857US2025309150A1Single-sided embeddable capacitors for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1943US2025140483A1Integrated passive devices with enhanced form factorSARAS MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2043US2024021372A1Pre-drilled vias to capture double sided capacitanceSARAS MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2141US2024312729A1Infiltration and drying under pressure for conductive polymer coating on porous substratesSARAS MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 2239US12500040B2Planar high-density aluminum capacitors for stacking and embeddingSARAS MICRO DEVICES INC·Filed 2021·Granted Dec 16, 2025·0 cites·41 claims
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