Assignee
SCHWANDNER JUERGEN
DE·15 granted patents·1 pending application·21 citations·filing 2008–2012
Top patents by PatentIndex Score
16 records- 0177US8647985B2Method for polishing a substrate composed of semiconductor materialSCHWANDNER JUERGEN·Filed 2008·Granted Feb 11, 2014·6 cites·13 claims
- 0275US8338302B2Method for polishing a semiconductor wafer with a strained-relaxed Si1−xGex layerSCHWANDNER JUERGEN·Filed 2009·Granted Dec 25, 2012·5 cites·21 claims
- 0372US8721390B2Method for the double-side polishing of a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted May 13, 2014·3 cites·11 claims
- 0468US8388411B2Method for polishing the edge of a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Mar 5, 2013·2 cites·18 claims
- 0567US8389409B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Mar 5, 2013·2 cites·14 claims
- 0663US8500516B2Method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Aug 6, 2013·1 cites·15 claims
- 0763US8444455B2Polishing pad and method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted May 21, 2013·1 cites·18 claims
- 0860US8551870B2Method for producing an epitaxially coated semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Oct 8, 2013·1 cites·18 claims
- 0949US2013072091A1Method for the double-side polishing of a semiconductor waferSCHWANDNER JUERGEN·Filed 2012·Application pending·0 cites
- 1048US9224613B2Method for polishing both sides of a semiconductor waferSCHWANDNER JUERGEN·Filed 2009·Granted Dec 29, 2015·0 cites·16 claims
- 1142US8501028B2Method for grinding a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Aug 6, 2013·0 cites·16 claims
- 1241US10707069B2Method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Jul 7, 2020·0 cites·20 claims
- 1340US8882565B2Method for polishing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Nov 11, 2014·0 cites·10 claims
- 1439US9533394B2Method for the local polishing of a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Jan 3, 2017·0 cites·16 claims
- 1538US8529315B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted Sep 10, 2013·0 cites·12 claims
- 1636US8685270B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Apr 1, 2014·0 cites·10 claims
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