Assignee
SEMPRIUS INC
US9 patents
Top patents by PatentIndex Score
US7927976B2Apr 19, 2011
Reinforced composite stamp for dry transfer printing of semiconductor elements
SEMPRIUS INC344 citations99
US9401344B2Jul 26, 2016
Substrates with transferable chiplets
SEMPRIUS INC22 citations92
US9307652B2Apr 5, 2016
Methods for surface attachment of flipped active components
SEMPRIUS INC23 citations92
US9660008B2May 23, 2017
High-yield fabrication of large-format substrates with distributed, independent control elements
SEMPRIUS INC7 citations84
US9443883B2Sep 13, 2016
Methods of forming printable integrated circuit devices and devices formed thereby
SEMPRIUS INC4 citations84
US9040425B2May 26, 2015
Methods of forming printable integrated circuit devices and devices formed thereby
SEMPRIUS INC4 citations84
US9603259B2Mar 21, 2017
Methods for surface attachment of flipped active components
SEMPRIUS INC1 citations63
US9343363B2May 17, 2016
Through-silicon vias and interposers formed by metal-catalyzed wet etching
SEMPRIUS INC2 citations63
US9362113B2Jun 7, 2016
Engineered substrates for semiconductor epitaxy and methods of fabricating the same
SEMPRIUS INC2 citations62