Electrically Bonded Arrays of Transfer Printed Active Components

Abstract

An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

1 .- 20 . (canceled) 
     
     
         21 . An electronic component, comprising:
 an active layer;   an electrical connection in contact with the active layer; and   a tab comprising a broken portion of a tether, the tab extending from a periphery of the electronic component.   
     
     
         22 . The electronic component of  claim 21 , wherein the electronic component is a light-emitting diode. 
     
     
         23 . An electronic component array comprising a target substrate and a plurality of electronic components of  claim 21  thereon. 
     
     
         24 . The electronic component array of  claim 23 , wherein the target substrate is different from the active layer. 
     
     
         25 . The electronic component array of  claim 23 , wherein the target substrate has conductive traces thereon, and wherein each of the conductive traces is electrically coupled to the electrical connection of a corresponding electronic component. 
     
     
         26 . The electronic component array of  claim 23 , wherein the target substrate comprises at least one of a flexible substrate and a polymer substrate. 
     
     
         27 . The electronic component of  claim 21 , wherein the electrical connection is electrically coupled to the active layer. 
     
     
         28 . The electronic component of  claim 21 , comprising:
 a first metal layer on a first side of the active layer; and   a second metal layer on a second side of the active layer, opposite the first side, wherein the electrical connection is in electrical contact with the second metal layer.   
     
     
         29 . The electronic component of  claim 28 , comprising:
 a first electrical interconnect at least in part on the second side of the active layer and electrically connected to the first metal layer; and   a second electrical interconnect at least in part on the second side of the active layer and electrically connected to the second metal layer.   
     
     
         30 . The electronic component of  claim 29 , comprising:
 an insulator at least partially between the active layer and the first electrical interconnect.   
     
     
         31 . The electronic component of  claim 29 , wherein the electronic component is on a target substrate with the second metal layer therebetween. 
     
     
         32 . The electronic component of  claim 31 , comprising:
 an adhesive layer between the electrical connection and the target substrate.   
     
     
         33 . The electronic component of  claim 32 , wherein the adhesive layer electrically connects the electrical connection to an electrical contact on the target substrate. 
     
     
         34 . The electronic component of  claim 33 , wherein the adhesive layer comprises a conductive layer. 
     
     
         35 . The electronic component of  claim 33 , wherein the adhesive layer comprises a material configured to transition between a nonconductive state and a conductive state responsive to curing thereof. 
     
     
         36 . The electronic component of  claim 33 , wherein the adhesive layer comprises at least one of a eutectic layer, a conductive film, and conductive nano-particles. 
     
     
         37 . The electronic component of  claim 21 , wherein the active layer comprises a crystalline, microcrystalline, polycrystalline, or amorphous semiconductor layer.