Inventor · disambiguated record
Etienne Menard
Also filed as: KHANG DAHL-YOUNG · MENARD ETIENNE
67 granted patents·10 pending applications·10,093 citations·filing 2005–2022
99Inventor score
Top patents by PatentIndex Score
77 records- 0199US9768086B2Methods and devices for fabricating and assembling printable semiconductor elementsUNIV ILLINOIS·Filed 2016·Granted Sep 19, 2017·32 cites·22 claims
- 0299US9761444B2Methods and devices for fabricating and assembling printable semiconductor elementsUNIV ILLINOIS·Filed 2016·Granted Sep 12, 2017·32 cites·41 claims
- 0399US9515025B2Stretchable form of single crystal silicon for high performance electronics on rubber substratesUNIV ILLINOIS·Filed 2015·Granted Dec 6, 2016·50 cites·18 claims
- 0499US9450043B2Methods and devices for fabricating and assembling printable semiconductor elementsUNIV ILLINOIS·Filed 2014·Granted Sep 20, 2016·79 cites·15 claims
- 0599US9161448B2Laser assisted transfer welding processMENARD ETIENNE·Filed 2012·Granted Oct 13, 2015·149 cites·27 claims
- 0699US9105555B2Stretchable form of single crystal silicon for high performance electronics on rubber substratesUNIV ILLINOIS·Filed 2014·Granted Aug 11, 2015·85 cites·30 claims
- 0799US8895406B2Release strategies for making transferable semiconductor structures, devices and device componentsROGERS JOHN A·Filed 2011·Granted Nov 25, 2014·211 cites·22 claims
- 0899US8754396B2Stretchable form of single crystal silicon for high performance electronics on rubber substratesROGERS JOHN A·Filed 2012·Granted Jun 17, 2014·274 cites·31 claims
- 0999US8664699B2Methods and devices for fabricating and assembling printable semiconductor elementsUNIV ILLINOIS·Filed 2013·Granted Mar 4, 2014·338 cites·8 claims
- 1099US8506867B2Printing semiconductor elements by shear-assisted elastomeric stamp transferMENARD ETIENNE·Filed 2009·Granted Aug 13, 2013·357 cites·29 claims
- 1199US8198621B2Stretchable form of single crystal silicon for high performance electronics on rubber substratesROGERS JOHN A·Filed 2009·Granted Jun 12, 2012·322 cites·44 claims
- 1299US7982296B2Methods and devices for fabricating and assembling printable semiconductor elementsUNIV ILLINOIS·Filed 2009·Granted Jul 19, 2011·398 cites·9 claims
- 1399US7943491B2Pattern transfer printing by kinetic control of adhesion to an elastomeric stampUNIV ILLINOIS·Filed 2006·Granted May 17, 2011·398 cites·40 claims
- 1499US7932123B2Release strategies for making transferable semiconductor structures, devices and device componentsUNIV ILLINOIS·Filed 2007·Granted Apr 26, 2011·342 cites·41 claims
- 1599US7622367B1Methods and devices for fabricating and assembling printable semiconductor elementsUNIV ILLINOIS·Filed 2005·Granted Nov 24, 2009·977 cites·18 claims
- 1699US7557367B2Stretchable semiconductor elements and stretchable electrical circuitsUNIV ILLINOIS·Filed 2005·Granted Jul 7, 2009·832 cites·61 claims
- 1799US7195733B2Composite patterning devices for soft lithographyUNIV ILLINOIS·Filed 2005·Granted Mar 27, 2007·514 cites·84 claims
- 1898US10374072B2Methods and devices for fabricating and assembling printable semiconductor elementsUNIV ILLINOIS·Filed 2017·Granted Aug 6, 2019·20 cites·19 claims
- 1998US9601671B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2015·Granted Mar 21, 2017·24 cites·20 claims
- 2098US9324733B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsUNIV ILLINOIS·Filed 2014·Granted Apr 26, 2016·71 cites·38 claims
- 2198US9165989B2High-yield fabrication of large-format substrates with distributed, independent control elementsBOWER CHRISTOPHER·Filed 2010·Granted Oct 20, 2015·65 cites·24 claims
- 2298US9117940B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2014·Granted Aug 25, 2015·52 cites·21 claims
- 2398US9049797B2Electrically bonded arrays of transfer printed active componentsMENARD ETIENNE·Filed 2011·Granted Jun 2, 2015·68 cites·32 claims
- 2498US8877648B2Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed therebyBOWER CHRISTOPHER·Filed 2010·Granted Nov 4, 2014·249 cites·15 claims
- 2598US8729524B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsROGERS JOHN A·Filed 2012·Granted May 20, 2014·148 cites·21 claims
- 2698US8722458B2Optical systems fabricated by printing-based assemblyROGERS JOHN·Filed 2011·Granted May 13, 2014·365 cites·67 claims
- 2798US8470701B2Printable, flexible and stretchable diamond for thermal managementROGERS JOHN A·Filed 2009·Granted Jun 25, 2013·289 cites·6 claims
- 2898US8440546B2Methods and devices for fabricating and assembling printable semiconductor elementsNUZZO RALPH G·Filed 2011·Granted May 14, 2013·345 cites·15 claims
- 2998US8394706B2Printable semiconductor structures and related methods of making and assemblingNUZZO RALPH G·Filed 2011·Granted Mar 12, 2013·224 cites·24 claims
- 3098US8261660B2Vacuum coupled tool apparatus for dry transfer printing semiconductor elementsMENARD ETIENNE·Filed 2009·Granted Sep 11, 2012·174 cites·33 claims
- 3198US8217381B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsROGERS JOHN A·Filed 2007·Granted Jul 10, 2012·195 cites·56 claims
- 3298US8039847B2Printable semiconductor structures and related methods of making and assemblingUNIV ILLINOIS·Filed 2010·Granted Oct 18, 2011·282 cites·23 claims
- 3398US7999454B2OLED device with embedded chip drivingGLOBAL OLED TECHNOLOGY LLC·Filed 2008·Granted Aug 16, 2011·332 cites·17 claims
- 3498US7972875B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2007·Granted Jul 5, 2011·596 cites·49 claims
- 3598US7927976B2Reinforced composite stamp for dry transfer printing of semiconductor elementsSEMPRIUS INC·Filed 2008·Granted Apr 19, 2011·344 cites·69 claims
- 3698US7799699B2Printable semiconductor structures and related methods of making and assemblingUNIV ILLINOIS·Filed 2006·Granted Sep 21, 2010·450 cites·41 claims
- 3797US10204864B2Stretchable form of single crystal silicon for high performance electronics on rubber substratesUNIV ILLINOIS·Filed 2016·Granted Feb 12, 2019·12 cites·28 claims
- 3897US9923133B2Structures and methods for testing printable integrated circuitsX CELEPRINT LTD·Filed 2015·Granted Mar 20, 2018·20 cites·21 claims
- 3997US9412727B2Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesionMENARD ETIENNE·Filed 2011·Granted Aug 9, 2016·99 cites·15 claims
- 4097US9349900B2Release strategies for making transferable semiconductor structures, devices and device componentsUNIV ILLINOIS·Filed 2014·Granted May 24, 2016·25 cites·69 claims
- 4196US10424572B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2017·Granted Sep 24, 2019·8 cites·22 claims
- 4296US10361180B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2017·Granted Jul 23, 2019·10 cites·12 claims
- 4396US9496155B2Methods of selectively transferring active componentsMENARD ETIENNE·Filed 2011·Granted Nov 15, 2016·39 cites·24 claims
- 4496US9142468B2Structures and methods for testing printable integrated circuitsBOWER CHRISTOPHER·Filed 2011·Granted Sep 22, 2015·31 cites·27 claims
- 4595US10504882B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2017·Granted Dec 10, 2019·7 cites·19 claims
- 4695US10355113B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsUNIV ILLINOIS·Filed 2016·Granted Jul 16, 2019·11 cites·24 claims
- 4795US10181483B2Laser assisted transfer welding processX CELEPRINT LTD·Filed 2015·Granted Jan 15, 2019·13 cites·16 claims
- 4894US10189243B2Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesionX CELEPRINT LTD·Filed 2016·Granted Jan 29, 2019·8 cites·11 claims
- 4994US9355854B2Methods of fabricating printable compound semiconductor devices on release layersMEITL MATTHEW·Filed 2011·Granted May 31, 2016·78 cites·31 claims
- 5091US10522575B2Methods of making printable device wafers with sacrificial layersX CELEPRINT LTD·Filed 2018·Granted Dec 31, 2019·3 cites·17 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Etienne Menard files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →