Assignee
SHEN CHI-CHIH
TW·8 granted patents·3 pending applications·117 citations·filing 2008–2012
Top patents by PatentIndex Score
11 records- 0197US8158888B2Circuit substrate and method of fabricating the same and chip package structureSHEN CHI-CHIH·Filed 2009·Granted Apr 17, 2012·81 cites·27 claims
- 0290US8446000B2Package structure and package processSHEN CHI-CHIH·Filed 2010·Granted May 21, 2013·19 cites·23 claims
- 0388US8258007B2Package processSHEN CHI-CHIH·Filed 2010·Granted Sep 4, 2012·10 cites·7 claims
- 0465US8531593B2Display panel with image capture module and assembling method of the sameSHEN CHI CHIH·Filed 2010·Granted Sep 10, 2013·1 cites·5 claims
- 0565US8110928B2Stacked-type chip package structure and method of fabricating the sameSHEN CHI-CHIH·Filed 2008·Granted Feb 7, 2012·3 cites·10 claims
- 0664US8618645B2Package process and package structureSHEN CHI-CHIH·Filed 2010·Granted Dec 31, 2013·1 cites·10 claims
- 0760US8105877B2Method of fabricating a stacked type chip package structureSHEN CHI-CHIH·Filed 2008·Granted Jan 31, 2012·2 cites·14 claims
- 0847US2010219524A1Chip scale package and method of fabricating the sameSHEN CHI-CHIH·Filed 2009·Application pending·0 cites
- 0947US2012205800A1Packaging structureSHEN CHI-CHIH·Filed 2012·Application pending·0 cites
- 1037US8390129B2Semiconductor device with a plurality of mark through substrate viasSHEN CHI-CHIH·Filed 2010·Granted Mar 5, 2013·0 cites·18 claims
- 1134US2011300669A1Method for Making Die AssembliesSHEN CHI-CHIH·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →