Assignee
SHI WEI
US·12 granted patents·9 pending applications·41 citations·filing 2005–2024
Top patents by PatentIndex Score
21 records- 0194US8076693B2Transparent heat spreader for LEDsSHI WEI·Filed 2010·Granted Dec 13, 2011·21 cites·4 claims
- 0274US8089085B2Heat sink base for LEDSSHI WEI·Filed 2009·Granted Jan 3, 2012·5 cites·17 claims
- 0374US8080827B2Top contact LED thermal managementSHI WEI·Filed 2008·Granted Dec 20, 2011·5 cites·15 claims
- 0473US8314552B2Phosphor layer arrangement for use with light emitting diodesSHI WEI·Filed 2010·Granted Nov 20, 2012·2 cites·5 claims
- 0573US8098011B2Phosphor layer arrangement for use with light emitting diodesSHI WEI·Filed 2010·Granted Jan 17, 2012·2 cites·13 claims
- 0664US9252336B2Multi-cup LED assemblySHI WEI·Filed 2008·Granted Feb 2, 2016·3 cites·19 claims
- 0762US8058664B2Transparent solder mask LED assemblySHI WEI·Filed 2008·Granted Nov 15, 2011·2 cites·10 claims
- 0861US8084283B2Top contact LED thermal managementSHI WEI·Filed 2010·Granted Dec 27, 2011·1 cites·6 claims
- 0955US2009203041A1Bmp4 inhibitorsSHI WEI·Filed 2007·Application pending·0 cites
- 1052US2012319573A1Phosphor Layer Arrangement for Use With Light Emitting DiodesSHI WEI·Filed 2011·Application pending·0 cites
- 1152US2011239454A1Substrate With Raised Edge PadsSHI WEI·Filed 2011·Application pending·0 cites
- 1249USD1102078SMopSHI WEI·Filed 2024·Granted Nov 11, 2025·0 cites·1 claims
- 1346US2007284730A1Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packagesSHI WEI·Filed 2006·Application pending·0 cites
- 1444USD1094898SHard hatSHI WEI·Filed 2023·Granted Sep 23, 2025·0 cites·1 claims
- 1544USD1087537SHard hatSHI WEI·Filed 2023·Granted Aug 12, 2025·0 cites·1 claims
- 1644US8781007B2Quantization method for OFDMSHI WEI·Filed 2010·Granted Jul 15, 2014·0 cites·20 claims
- 1744US2010078661A1Machined surface led assemblySHI WEI·Filed 2008·Application pending·0 cites
- 1844US2010246138A1Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packagesSHI WEI·Filed 2010·Application pending·0 cites
- 1942US2008067668A1Microelectronic package, method of manufacturing same, and system containing sameSHI WEI·Filed 2006·Application pending·0 cites
- 2041US2007152321A1Fluxless heat spreader bonding with cold form solderSHI WEI·Filed 2005·Application pending·0 cites
- 2141US2007228112A1Method and arrangement for forming a microelectronic packageSHI WEI·Filed 2006·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →