Substrate With Raised Edge Pads

Abstract

A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.

1 . A method comprising:
 forming an electrical connection between two electrical components using a contact on one component and a landside pad on the other component, said landside pad having a raised edge.   
     
     
         2 . The method of  claim 1  including providing a landside pad with a closed raised edge. 
     
     
         3 . The method of  claim 2  including providing a landside pad with a circular raised edge. 
     
     
         4 . The method of  claim 1  including providing a socket contact that has a shape that conforms to the shape of said landside pad raised edge. 
     
     
         5 . The method of  claim 4  including providing a circular raised edge and a circular contact. 
     
     
         6 . The method of  claim 5  including providing a raised edge and a contact with substantially the same radii of curvature. 
     
     
         7 . The method of  claim 1  including contacting the landside pad with said contact on two different surfaces. 
     
     
         8 . The method of  claim 7  including providing two transverse contacting surfaces between said pad and said contact. 
     
     
         9 . The method of  claim 1  including forming said landside pad by forming a first substantially planar landside pad portion and depositing a second layer to form said raised edge. 
     
     
         10 . A method comprising:
 forming a substantially planar portion of a landside pad on an electrical component; and   forming a raised edge on said portion by depositing a metal on said substantially planar portion.   
     
     
         11 . The method of  claim 10  including forming said raised edge in a closed geometric shape. 
     
     
         12 . The method of  claim 11  including forming said raised edge in a circular shape. 
     
     
         13 . The method of  claim 10  including forming the planar portion of said landside pad, patterning a mask over said planar portion and depositing a metal in the mask formed over said planar portion to form said raised edge. 
     
     
         14 . The method of  claim 13  including providing solder resist around the resulting landside pad.