Inventor · disambiguated record
Wei Shi
Also filed as: SHI WEI · SHI WEI O
14 granted patents·13 pending applications·406 citations·filing 2005–2025
92Inventor score
Top patents by PatentIndex Score
27 records- 0198US7432592B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2005·Granted Oct 7, 2008·294 cites·9 claims
- 0296US7554203B2Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufactureINTEL CORP·Filed 2006·Granted Jun 30, 2009·65 cites·15 claims
- 0388US9933601B2Stacked wafer lens and cameraINTEL CORP·Filed 2015·Granted Apr 3, 2018·6 cites·23 claims
- 0486US8012808B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2008·Granted Sep 6, 2011·15 cites·12 claims
- 0578US7439617B2Capillary underflow integral heat spreaderINTEL CORP·Filed 2006·Granted Oct 21, 2008·10 cites·21 claims
- 0675US7939922B2Forming compliant contact pads for semiconductor packagesINTEL CORP·Filed 2009·Granted May 10, 2011·4 cites·6 claims
- 0775US7564066B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2005·Granted Jul 21, 2009·5 cites·11 claims
- 0870US8189361B2Multi-chip assembly with optically coupled dieZHOU QING A·Filed 2010·Granted May 29, 2012·3 cites·4 claims
- 0970US2025389175A1Hydrogen generation within high salinity hydrocarbon-bearing reservoirsCHEVRON USA INC·Filed 2025·Application pending·0 cites
- 1068US2025375783A1Knapsack sprayerNANJING CHERVON IND CO LTD·Filed 2025·Application pending·0 cites
- 1165US7348678B2Integrated circuit package to provide high-bandwidth communication among multiple diceINTEL CORP·Filed 2005·Granted Mar 25, 2008·3 cites·3 claims
- 1263US2025369837A1Modified core samples for testing scale squeezeCHEVRON USA INC·Filed 2024·Application pending·0 cites
- 1360US7851809B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2009·Granted Dec 14, 2010·1 cites·5 claims
- 1454US8148805B2Forming compliant contact pads for semiconductor packagesZHOU QING·Filed 2011·Granted Apr 3, 2012·0 cites·10 claims
- 1552US7538019B2Forming compliant contact pads for semiconductor packagesINTEL CORP·Filed 2005·Granted May 26, 2009·0 cites·19 claims
- 1652US2011239454A1Substrate With Raised Edge PadsSHI WEI·Filed 2011·Application pending·0 cites
- 1751US7980865B2Substrate with raised edge padsINTEL CORP·Filed 2005·Granted Jul 19, 2011·0 cites·10 claims
- 1846US2007284730A1Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packagesSHI WEI·Filed 2006·Application pending·0 cites
- 1944US2010246138A1Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packagesSHI WEI·Filed 2010·Application pending·0 cites
- 2043US2008157345A1Curved heat spreader design for electronic assembliesLU DAOQIANG·Filed 2006·Application pending·0 cites
- 2142US2008067668A1Microelectronic package, method of manufacturing same, and system containing sameSHI WEI·Filed 2006·Application pending·0 cites
- 2241US2007152321A1Fluxless heat spreader bonding with cold form solderSHI WEI·Filed 2005·Application pending·0 cites
- 2341US2007126103A1Microelectronic 3-D package defining thermal through vias and method of making sameINTEL CORP·Filed 2005·Application pending·0 cites
- 2441US2007228112A1Method and arrangement for forming a microelectronic packageSHI WEI·Filed 2006·Application pending·0 cites
- 2541US2007158807A1Edge interconnects for die stackingLU DAOQIANG·Filed 2005·Application pending·0 cites
- 2639US9602804B2Methods of forming integrated package structures with low Z height 3D cameraINTEL CORP·Filed 2015·Granted Mar 21, 2017·0 cites·24 claims
- 2739US2006273450A1Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used thereforINTEL CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →