Inventor · disambiguated record
Jiangqi He
Also filed as: HE JIANGQI
55 granted patents·15 pending applications·897 citations·filing 2001–2022
98Inventor score
Top patents by PatentIndex Score
70 records- 0198US7432592B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2005·Granted Oct 7, 2008·294 cites·9 claims
- 0297US7659143B2Dual-chip integrated heat spreader assembly, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted Feb 9, 2010·71 cites·18 claims
- 0396US7554203B2Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufactureINTEL CORP·Filed 2006·Granted Jun 30, 2009·65 cites·15 claims
- 0496US7535080B2Reducing parasitic mutual capacitancesINTEL CORP·Filed 2005·Granted May 19, 2009·87 cites·14 claims
- 0596US7373033B2Chip-to-chip optical interconnectINTEL CORP·Filed 2006·Granted May 13, 2008·67 cites·19 claims
- 0694US7723164B2Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 25, 2010·32 cites·23 claims
- 0791US7477197B2Package level integration of antenna and RF front-end moduleINTEL CORP·Filed 2006·Granted Jan 13, 2009·32 cites·20 claims
- 0888US11373966B2Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applicationsHUAWEI TECH CO LTD·Filed 2020·Granted Jun 28, 2022·2 cites·19 claims
- 0981US7511359B2Dual die package with high-speed interconnectINTEL CORP·Filed 2005·Granted Mar 31, 2009·11 cites·10 claims
- 1081US7123466B2Extended thin film capacitor (TFC)INTEL CORP·Filed 2005·Granted Oct 17, 2006·8 cites·18 claims
- 1181US6885544B2Vertical capacitor apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Apr 26, 2005·25 cites·19 claims
- 1280US9318850B2Shielding a connector to reduce interferenceINTEL CORP·Filed 2014·Granted Apr 19, 2016·4 cites·16 claims
- 1379US7227247B2IC package with signal land padsINTEL CORP·Filed 2005·Granted Jun 5, 2007·10 cites·23 claims
- 1478US7142073B2Transmission line impedance matchingINTEL CORP·Filed 2004·Granted Nov 28, 2006·10 cites·24 claims
- 1577US6803649B1Electronic assemblyINTEL CORP·Filed 2003·Granted Oct 12, 2004·21 cites·20 claims
- 1676US7255573B2Data signal interconnection with reduced crosstalkINTEL CORP·Filed 2005·Granted Aug 14, 2007·16 cites·11 claims
- 1776US7027289B2Extended thin film capacitor (TFC)INTEL CORP·Filed 2004·Granted Apr 11, 2006·17 cites·30 claims
- 1875US7939922B2Forming compliant contact pads for semiconductor packagesINTEL CORP·Filed 2009·Granted May 10, 2011·4 cites·6 claims
- 1975US7564066B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2005·Granted Jul 21, 2009·5 cites·11 claims
- 2075US7417872B2Circuit board with trace configuration for high-speed digital differential signalingINTEL CORP·Filed 2006·Granted Aug 26, 2008·5 cites·5 claims
- 2175US7110263B2Reference slots for signal tracesINTEL CORP·Filed 2004·Granted Sep 19, 2006·19 cites·17 claims
- 2274US7432779B2Transmission line impedance matchingINTEL CORP·Filed 2007·Granted Oct 7, 2008·4 cites·17 claims
- 2374US7218183B2Transmission line impedance matchingINTEL CORP·Filed 2006·Granted May 15, 2007·4 cites·7 claims
- 2472US7279391B2Integrated inductors and compliant interconnects for semiconductor packagingINTEL CORP·Filed 2005·Granted Oct 9, 2007·5 cites·6 claims
- 2571US7611924B2Integrated circuit package with chip-side signal connectionsINTEL CORP·Filed 2008·Granted Nov 3, 2009·4 cites·10 claims
- 2670US8189361B2Multi-chip assembly with optically coupled dieZHOU QING A·Filed 2010·Granted May 29, 2012·3 cites·4 claims
- 2770US7345359B2Integrated circuit package with chip-side signal connectionsINTEL CORP·Filed 2004·Granted Mar 18, 2008·14 cites·11 claims
- 2868US7709934B2Package level noise isolationINTEL CORP·Filed 2006·Granted May 4, 2010·4 cites·14 claims
- 2965US7535689B2Reducing input capacitance of high speed integrated circuitsINTEL CORP·Filed 2007·Granted May 19, 2009·4 cites·8 claims
- 3065US7348678B2Integrated circuit package to provide high-bandwidth communication among multiple diceINTEL CORP·Filed 2005·Granted Mar 25, 2008·3 cites·3 claims
- 3160US7851809B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2009·Granted Dec 14, 2010·1 cites·5 claims
- 3260US7589414B2I/O Architecture for integrated circuit packageINTEL CORP·Filed 2007·Granted Sep 15, 2009·1 cites·11 claims
- 3360US7352557B2Vertical capacitor apparatus, systems, and methodsINTEL CORP·Filed 2005·Granted Apr 1, 2008·2 cites·14 claims
- 3460US6914334B2Circuit board with trace configuration for high-speed digital differential signalingINTEL CORP·Filed 2002·Granted Jul 5, 2005·7 cites·8 claims
- 3559US6731493B2Low impedance inter-digital capacitor and method of usingINTEL CORP·Filed 2002·Granted May 4, 2004·7 cites·17 claims
- 3658US12079064B2Chip-process-variation-aware power-efficiency optimizationHUAWEI TECH CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 3758US8465297B2Self referencing pinZOU BIN·Filed 2010·Granted Jun 18, 2013·1 cites·18 claims
- 3857US7852189B2Packaged spiral inductor structures, processes of making same, and systems containing sameINTEL CORP·Filed 2005·Granted Dec 14, 2010·1 cites·22 claims
- 3954US8148805B2Forming compliant contact pads for semiconductor packagesZHOU QING·Filed 2011·Granted Apr 3, 2012·0 cites·10 claims
- 4054US6784532B2Power/ground configuration for low impedance integrated circuitINTEL CORP·Filed 2002·Granted Aug 31, 2004·6 cites·20 claims
- 4153US6995465B2Silicon building block architecture with flex tapeINTEL CORP·Filed 2003·Granted Feb 7, 2006·4 cites·10 claims
- 4252US7538019B2Forming compliant contact pads for semiconductor packagesINTEL CORP·Filed 2005·Granted May 26, 2009·0 cites·19 claims
- 4352US2011239454A1Substrate With Raised Edge PadsSHI WEI·Filed 2011·Application pending·0 cites
- 4451US7989916B2Integrated capacitors in package-level structures, processes of making same, and systems containing sameINTEL CORP·Filed 2009·Granted Aug 2, 2011·0 cites·22 claims
- 4551US7980865B2Substrate with raised edge padsINTEL CORP·Filed 2005·Granted Jul 19, 2011·0 cites·10 claims
- 4650US6964584B2Low impedance, high-power socket and method of usingINTEL CORP·Filed 2001·Granted Nov 15, 2005·5 cites·19 claims
- 4749US7145239B2Circuit board with trace configuration for high-speed digital differential signalingINTEL CORP·Filed 2004·Granted Dec 5, 2006·2 cites·14 claims
- 4848US7205638B2Silicon building blocks in integrated circuit packagingINTEL CORP·Filed 2004·Granted Apr 17, 2007·2 cites·15 claims
- 4948US7173803B2Low impedance inter-digital capacitor and method of usingINTEL CORP·Filed 2004·Granted Feb 6, 2007·2 cites·12 claims
- 5048US6815256B2Silicon building blocks in integrated circuit packagingINTEL CORP·Filed 2002·Granted Nov 9, 2004·2 cites·6 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →