Inventor · disambiguated record
Qing Zhou
Also filed as: ZHOU QING · ZHOU QING A
12 granted patents·4 pending applications·400 citations·filing 2005–2023
91Inventor score
Files withINTEL CORP9SHI WEI3INST OF EARTH ENVIRONMENT CHINESE ACADEMY OF SCIENCES1LU DAOQIANG1ZHOU QING1
Top patents by PatentIndex Score
16 records- 0198US7432592B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2005·Granted Oct 7, 2008·294 cites·9 claims
- 0296US7554203B2Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufactureINTEL CORP·Filed 2006·Granted Jun 30, 2009·65 cites·15 claims
- 0387US11851966B1Horizontal sampling soil drilling rig and control method thereofINST OF EARTH ENVIRONMENT CHINESE ACADEMY OF SCIENCES·Filed 2023·Granted Dec 26, 2023·10 cites·9 claims
- 0486US8012808B2Integrated micro-channels for 3D through silicon architecturesINTEL CORP·Filed 2008·Granted Sep 6, 2011·15 cites·12 claims
- 0575US7939922B2Forming compliant contact pads for semiconductor packagesINTEL CORP·Filed 2009·Granted May 10, 2011·4 cites·6 claims
- 0675US7564066B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2005·Granted Jul 21, 2009·5 cites·11 claims
- 0770US8189361B2Multi-chip assembly with optically coupled dieZHOU QING A·Filed 2010·Granted May 29, 2012·3 cites·4 claims
- 0865US7348678B2Integrated circuit package to provide high-bandwidth communication among multiple diceINTEL CORP·Filed 2005·Granted Mar 25, 2008·3 cites·3 claims
- 0960US7851809B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2009·Granted Dec 14, 2010·1 cites·5 claims
- 1054US8148805B2Forming compliant contact pads for semiconductor packagesZHOU QING·Filed 2011·Granted Apr 3, 2012·0 cites·10 claims
- 1152US7538019B2Forming compliant contact pads for semiconductor packagesINTEL CORP·Filed 2005·Granted May 26, 2009·0 cites·19 claims
- 1252US2011239454A1Substrate With Raised Edge PadsSHI WEI·Filed 2011·Application pending·0 cites
- 1351US7980865B2Substrate with raised edge padsINTEL CORP·Filed 2005·Granted Jul 19, 2011·0 cites·10 claims
- 1442US2008067668A1Microelectronic package, method of manufacturing same, and system containing sameSHI WEI·Filed 2006·Application pending·0 cites
- 1541US2007152321A1Fluxless heat spreader bonding with cold form solderSHI WEI·Filed 2005·Application pending·0 cites
- 1641US2007158807A1Edge interconnects for die stackingLU DAOQIANG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →