Assignee
SHI XIAOBO
US·7 granted patents·1 pending application·5 citations·filing 2009–2012
Top patents by PatentIndex Score
8 records- 0171US8906123B2CMP slurry/method for polishing ruthenium and other filmsSHI XIAOBO·Filed 2011·Granted Dec 9, 2014·2 cites·10 claims
- 0261US8252688B2Method and composition for chemical mechanical planarization of a metal or a metal alloySHI XIAOBO·Filed 2009·Granted Aug 28, 2012·1 cites·15 claims
- 0360US8551887B2Method for chemical mechanical planarization of a copper-containing substrateSHI XIAOBO·Filed 2010·Granted Oct 8, 2013·1 cites·17 claims
- 0458US8414789B2Method and composition for chemical mechanical planarization of a metalSHI XIAOBO·Filed 2009·Granted Apr 9, 2013·1 cites·8 claims
- 0549US8222145B2Method and composition for chemical mechanical planarization of a metal-containing substrateSHI XIAOBO·Filed 2010·Granted Jul 17, 2012·0 cites·9 claims
- 0648US2013153820A1Method and Composition for Chemical Mechanical Planarization of a Metal-Containing SubstrateSHI XIAOBO·Filed 2012·Application pending·0 cites
- 0747US8697577B2Method and composition for chemical mechanical planarization of a metal or a metal alloySHI XIAOBO·Filed 2012·Granted Apr 15, 2014·0 cites·8 claims
- 0844US8821751B2Chemical mechanical planarization composition and method with low corrosivenessSHI XIAOBO·Filed 2011·Granted Sep 2, 2014·0 cites·20 claims
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