Method and Composition for Chemical Mechanical Planarization of a Metal-Containing Substrate

Abstract

A composition and associated method for chemical mechanical planarization of a metal-containing substrate afford low dishing levels in the polished substrate while simultaneously affording high metal removal rates. Suitable metal-containing substrates include tungsten- and copper-containing substrates. Components in the composition include a silatrane compound, an abrasive, and, optionally, a strong oxidizing agent, such as a per-compound.

1 - 9 . (canceled) 
     
     
         10 . A polishing composition comprising:
 a) an abrasive;   b) a silatrane compound comprising a polycyclic compound and having at least one silicon atom present in a first bridgehead position and having at least one nitrogen atom present in a second bridgehead position; and   c) an oxidizing agent.   
     
     
         11 . The composition of  claim 10  wherein the silatrane compound has the structure: 
       
         
           
           
               
               
           
         
         where i, j, and m are each independently 1-4 and X is a substituent or group covalently bonded to the Si atom in the structure. 
       
     
     
         12 . The composition of  claim 11  wherein X is selected from the group consisting of C 1 -C 4 -alkyl, C 1 -C 4 -alkoxy, C 1 -C 4 -amino, C 1 -C 4 -amino-alcohol, C 1 -C 4 -carboxylic acid, and C 1 -C 4 -glycol. 
     
     
         13 . The composition of  claim 11  wherein the silatrane compound has the structure: 
       
         
           
           
               
               
           
         
         where n is 1-6. 
       
     
     
         14 . The composition of  claim 13  wherein the silatrane compound has the structure: 
       
         
           
           
               
               
           
         
       
     
     
         15 . The composition of  claim 10  wherein the polishing composition has a pH from about 1 to about 5. 
     
     
         16 . The composition of  claim 10  wherein the oxidizing agent is hydrogen peroxide.