Assignee
SHIM IL KWON
SG·17 granted patents·3 pending applications·196 citations·filing 2006–2013
Top patents by PatentIndex Score
20 records- 0197US8309397B2Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereofSHIM IL KWON·Filed 2011·Granted Nov 13, 2012·26 cites·10 claims
- 0297US8072059B2Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor dieSHIM IL KWON·Filed 2009·Granted Dec 6, 2011·54 cites·25 claims
- 0394US8846454B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSHIM IL KWON·Filed 2012·Granted Sep 30, 2014·13 cites·28 claims
- 0494US8643163B2Integrated circuit package-on-package stacking system and method of manufacture thereofSHIM IL KWON·Filed 2009·Granted Feb 4, 2014·35 cites·20 claims
- 0590US9006888B2Semiconductor device and method of forming stress relief layer between die and interconnect structureSHIM IL KWON·Filed 2011·Granted Apr 14, 2015·9 cites·25 claims
- 0689US8957530B2Integrated circuit packaging system with embedded circuitry and postSHIM IL KWON·Filed 2011·Granted Feb 17, 2015·9 cites·10 claims
- 0789US8421202B2Integrated circuit packaging system with flex tape and method of manufacture thereofSHIM IL KWON·Filed 2010·Granted Apr 16, 2013·10 cites·20 claims
- 0889US8395251B2Integrated circuit package to package stacking systemSHIM IL KWON·Filed 2006·Granted Mar 12, 2013·18 cites·14 claims
- 0987US8222717B2Embedded semiconductor die package and method of making the same using metal frame carrierSHIM IL KWON·Filed 2010·Granted Jul 17, 2012·6 cites·25 claims
- 1086US8659113B2Embedded semiconductor die package and method of making the same using metal frame carrierSHIM IL KWON·Filed 2012·Granted Feb 25, 2014·5 cites·13 claims
- 1182US9299648B2Integrated circuit packaging system with patterned substrate and method of manufacture thereofSHIM IL KWON·Filed 2010·Granted Mar 29, 2016·6 cites·20 claims
- 1272US9034693B2Integrated circuit package with open substrate and method of manufacturing thereofSHIM IL KWON·Filed 2011·Granted May 19, 2015·2 cites·5 claims
- 1369US9202793B1Integrated circuit packaging system with under bump metallization and method of manufacture thereofSHIM IL KWON·Filed 2013·Granted Dec 1, 2015·2 cites·10 claims
- 1459US8981548B2Integrated circuit package system with reliefSHIM IL KWON·Filed 2008·Granted Mar 17, 2015·1 cites·20 claims
- 1553US9252066B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSHIM IL KWON·Filed 2011·Granted Feb 2, 2016·0 cites·24 claims
- 1649US2012217634A9Semiconductor Device and Method of Forming the Device Using Sacrificial CarrierSHIM IL KWON·Filed 2011·Application pending·0 cites
- 1747US9177898B2Integrated circuit package system with locking terminalSHIM IL KWON·Filed 2008·Granted Nov 3, 2015·0 cites·20 claims
- 1844US9000579B2Integrated circuit package system with bonding in viaSHIM IL KWON·Filed 2007·Granted Apr 7, 2015·0 cites·18 claims
- 1943US2008272487A1System for implementing hard-metal wire bondsSHIM IL KWON·Filed 2008·Application pending·0 cites
- 2038US2010289142A1Integrated circuit packaging system with coin bonded interconnects and method of manufacture thereofSHIM IL KWON·Filed 2010·Application pending·0 cites
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