Assignee
SIMMONS-MATTHEWS MARGARET R
US·1 granted patent·2 pending applications·17 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0186US8227295B2IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSVSIMMONS-MATTHEWS MARGARET R·Filed 2009·Granted Jul 24, 2012·17 cites·11 claims
- 0245US2013099384A1Stacked IC Devices Comprising a Workpiece Solder Connected to the TSVSIMMONS-MATTHEWS MARGARET R·Filed 2012·Application pending·0 cites
- 0333US2010190294A1Methods for controlling wafer and package warpage during assembly of very thin dieSIMMONS-MATTHEWS MARGARET R·Filed 2010·Application pending·0 cites
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