Assignee
SON HO YOUNG
KR·4 granted patents·2 pending applications·17 citations·filing 2009–2012
Top patents by PatentIndex Score
6 records- 0188US8310045B2Semiconductor package with heat dissipation devicesSON HO YOUNG·Filed 2011·Granted Nov 13, 2012·11 cites·20 claims
- 0278US8816477B2Semiconductor package having a contamination preventing layer formed in the semiconductor chipSON HO YOUNG·Filed 2012·Granted Aug 26, 2014·4 cites·14 claims
- 0369US8669642B2Semiconductor chip and fabricating method thereofSON HO YOUNG·Filed 2012·Granted Mar 11, 2014·2 cites·20 claims
- 0449US2013161826A1Semiconductor chip and stacked semiconductor package having the sameSON HO YOUNG·Filed 2012·Application pending·0 cites
- 0547US8217434B2Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the sameSON HO YOUNG·Filed 2009·Granted Jul 10, 2012·0 cites·8 claims
- 0638US2012112360A1Semiconductor chip, stacked semiconductor package having the same, and method for manufacturing stacked semiconductor packageSON HO YOUNG·Filed 2011·Application pending·0 cites
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