Assignee
SUGA TADATOMO
JP·9 granted patents·3 pending applications·55 citations·filing 2003–2022
Top patents by PatentIndex Score
12 records- 0196US9142532B2Chip-on-wafer bonding method and bonding device, and structure comprising chip and waferSUGA TADATOMO·Filed 2013·Granted Sep 22, 2015·25 cites·51 claims
- 0290US8091764B2Joining method and device produced by this method and joining unitSUGA TADATOMO·Filed 2010·Granted Jan 10, 2012·13 cites·4 claims
- 0389US9870922B2Substrate bonding apparatus and substrate bonding methodSUGA TADATOMO·Filed 2015·Granted Jan 16, 2018·6 cites·25 claims
- 0480US9601350B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Mar 21, 2017·6 cites·12 claims
- 0570US10204785B2Substrate bonding apparatus and substrate bonding methodSUGA TADATOMO·Filed 2017·Granted Feb 12, 2019·1 cites·14 claims
- 0665US10166749B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Jan 1, 2019·2 cites·13 claims
- 0755US9962908B2Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrateSUGA TADATOMO·Filed 2013·Granted May 8, 2018·0 cites·19 claims
- 0855US2021265300A1Bonding system and bonding methodSUGA TADATOMO·Filed 2018·Application pending·0 cites
- 0954US2024274571A1Semiconductor substrate assembly and manufacturing method thereforSUGA TADATOMO·Filed 2022·Application pending·0 cites
- 1052US2024066624A1Bonding method, bonder, and bonding systemSUGA TADATOMO·Filed 2022·Application pending·0 cites
- 1149US8651363B2Joining method and device produced by this method and joining unitSUGA TADATOMO·Filed 2011·Granted Feb 18, 2014·0 cites·11 claims
- 1245US7591293B2Device for bonding a metal on a surface of a substrateSUGA TADATOMO·Filed 2003·Granted Sep 22, 2009·2 cites·1 claims
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