Bonding system and bonding method

Abstract

A chip bonding system including an activation treatment device including a frame holder and a particle beam source that irradiates a sheet, to which a chip held by the frame holder is stuck, with a particle beam, to thereby activate a bonding surface of the chip; and a bonding device that brings the chip, of which the bonding surface is activated by the activation treatment device, into contact with a substrate, to thereby bond the chip to the substrate. The frame holder supports a holding frame in a posture in which one side, to which the chip is stuck, in the sheet, of the holding frame that holds the sheet TE, which is formed of a resin, and to which the chip is stuck, is exposed to the particle beam source.

1 . A bonding system for bonding a second article to a first article the bonding system comprising:
 an activation treatment device that comprises an object supporter that supports objects comprising the second article to be bonded, and a particle beam source that activates a bonding surface of the second article to be bonded by irradiating the objects with a particle beam, the objects being set on one treatment surface without being opposed to each other, followed by performing activation treatment by the particle beam source; and   a bond device that brings the second article to be bonded, of which the bonding surface is activated by the activation treatment device, into contact with the first article to be bonded, to thereby bond the second article to be bonded to the first article to be bonded,   wherein the object supporter supports the objects in a posture in which a portion formed of a plurality of kinds of materials comprising the bonding surface of the second article to be bonded in the objects is exposed to the particle beam source.   
     
     
         2 . The bonding system according to  claim 1 , wherein
 the particle beam comprises nitrogen.   
     
     
         3 . The bonding system according to  claim 1 , wherein
 the object supporter holds the objects in a posture in which the bonding surface of the second article to be bonded faces vertically downward, and   the particle beam source irradiates the bonding surface of the second article to be bonded with the particle beam from a section vertically below the objects.   
     
     
         4 . The bonding system according to  claim 1 , wherein
 the first article to be bonded is a substrate,   the second article to be bonded is a chip,   the object supporter comprises:
 a holding frame that holds a sheet which is formed of a resin, and to which the second article to be bonded is stuck; and 
 a supporter that supports the holding frame in a posture in which one side to which the second article to be bonded is stuck in the sheet faces the particle beam source, and 
   the particle beam source irradiates the bonding surface of each of the second article to be bonded, which is in a state of being stuck to the sheet, with a particle beam.   
     
     
         5 . The bonding system according to  claim 4 , wherein
 the particle beam source is set so that an incidence angle of the particle beam with respect to a virtual surface comprising the bonding surface of the second article to be bonded is 30 degrees or more and 80 degrees or less.   
     
     
         6 . The bonding system according to  claim 4 , wherein
 a plurality of second articles to be bonded are stuck at an equal spacing, and   an incidence angle of the particle beam with respect to a virtual surface comprising bonding surfaces of the plurality of second articles to be bonded is set so that a relational equation of the following equation (1) is established when the incidence angle is set at 01, a spacing between the plurality of second articles to be bonded adjacent to each other is set at L 1 , and the thickness of the second article to be bonded is set at T 1 .   
       
         
           
             
               
                 
                   
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                       Equation 
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                       1 
                     
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                       θ1 
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                           tan 
                           
                             - 
                             1 
                           
                         
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                             L 
                             ⁢ 
                             
                                 
                             
                             ⁢ 
                             1 
                           
                           
                             T 
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                             ⁢ 
                             1 
                           
                         
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                     Equation 
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                       ( 
                       1 
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         7 . The bonding system according to  claim 4 , wherein the activation treatment device further comprises a cover that covers a portion excluding a portion to which the second article to be bonded is stuck in one side, to which the second article to be bonded is stuck, of the sheet in a state in which the holding frame is supported by the supporter. 
     
     
         8 . The bonding system according to  claim 1 , wherein the activation treatment device activates the bonding surfaces of a plurality of second articles to be bonded, just after dicing a substrate to be diced, which is a base material of the second article to be bonded, and in a state of coming into contact with each other or in a state of being connected to each other. 
     
     
         9 . The bonding system according to  claim 4 , the bonding system further comprising a cleaning device that cleans the second article to be bonded. 
     
     
         10 . The bonding system according to  claim 9 , wherein the cleaning device cleans the second article to be bonded in a state in which a sheet to which the at last one second article to be bonded is stuck is held by the holding frame. 
     
     
         11 . The bonding system according to  claim 10 , wherein
 the second article to be bonded, of which the number is plural, exists,   a plurality of second articles to be bonded are produced by dicing a substrate to be diced, which is a base material of the plurality of second articles to be bonded,   the cleaning device cleans the plurality of second articles to be bonded just after dicing the substrate to be diced, and in a state of coming into contact with each other or in a state of being connected to each other, and   the bonding system further comprises a separation device that allows the plurality of second articles to be bonded to be in a state of being spaced from each other by extending the sheet held by the holding frame that holds the sheet to which the plurality of second articles to be bonded are stuck.   
     
     
         12 . The bonding system according to  claim 10 , wherein
 the second article to be bonded, of which the number is plural, exists,   the cleaning device comprises:
 an inner supporter that supports an interior of the holding frame in the sheet held by the holding frame; 
 a frame supporter that supports the holding frame, and that is movable to the inner supporter; 
 a frame driver that drives the frame supporter; and 
 a rotary driver that rotates the inner supporter and the frame supporter about a rotation axis along the thickness direction of the holding frame; 
   the frame driver moves the frame supporter relatively with respect to the inner supporter, whereby a first site, to which a plurality of second articles to be bonded are stuck, in the sheet, and a second site fixed to the holding frame are allowed to be in a state of being spaced from each other so that the first site is closer to a direction of an axis of rotation of the sheet than the second site; and   the rotary driver rotates the inner supporter and the frame supporter in a state in which the first site, to which the plurality of second articles to be bonded are stuck, in the sheet, and a second site fixed to the holding frame are spaced from each other so that the first site is closer to a direction of an axis of rotation of the sheet than the second site, whereby the sheet and the plurality of second articles to be bonded are cleaned.   
     
     
         13 . The bonding system according to  claim 12 , wherein
 the cleaning device further comprises a sucker that sucks the first site, to which the plurality of second articles to be bonded are stuck, in the sheet just after dicing the substrate to be diced, and in a state of coming into contact with each other or in a state of being connected to each other, from a side opposite to the plurality of second articles to be bonded in the sheet, and   the frame driver moves the frame supporter relatively with respect to the inner supporter in a state in which the first site in the sheet is sucked by the sucker, whereby the first site, to which the plurality of second articles to be bonded are stuck, in the sheet, and a second site fixed to the holding frame are allowed to be in a state of being spaced from each other so that the first site is closer to a direction of an axis of rotation of the sheet than the second site.   
     
     
         14 . The bonding system according to  claim 1 , wherein plural kinds of regions with different materials are formed on the bonding surface of the second article to be bonded. 
     
     
         15 . The bonding system according to  claim 14 , wherein
 an electrode and an insulator film are disposed on the bonding surface of the second article to be bonded, and   the insulator film is formed of an oxide, an oxynitride, or a nitride.   
     
     
         16 . The bonding system according to  claim 1 , wherein the activation treatment device moves at least one of the particle beam source and the objects relatively with respect to another of the particle beam source and the objects. 
     
     
         17 . The bonding system according to  claim 1 , wherein the particle beam source is a fast atom beam source. 
     
     
         18 . The bonding system according to  claim 1 , wherein the activation treatment device further comprises a radical source that irradiates the bonding surface of the second article to be bonded with a nitrogen radical. 
     
     
         19 . The bonding system according to  claim 1 , wherein the bond device causes hydrophilic bonding of the second article to be bonded to the first article to be bonded. 
     
     
         20 . The bonding system according to  claim 1 , wherein
 each of the second article to be bonded is a chip comprising an uneven portion on a circumference closer to the bonding surface,   the bonding system further comprises:
 a device for supplying the second article to be bonded that supplies the second article to be bonded; and 
 a device for transporting the second article to be bonded that transports the second article to be bonded supplied from the device for supplying the second article to be bonded, to the bond device, and 
   the device for transporting the second article to be bonded comprises a holder for the second article to be bonded that holds a portion opposite to the bonding surface in the uneven portion of the second article to be bonded.   
     
     
         21 . The bonding system according to  claim 1 , wherein
 the second article to be bonded, of which the number is plural, exists, and   the bond device comprises:
 a substrate supporter that holds the first article to be bonded; 
 a frame supporter that supports a holding frame that holds a sheet to which a plurality of second articles to be bonded are stuck; 
 a head that abuts on a side opposite to the plurality of second articles to be bonded in the sheet; and 
 a head driver that drives the head in a direction of approaching the substrate supporter, to thereby bond each of the second article to be bonded to the first article to be bonded. 
   
     
     
         22 . A bonding system that bonds a second article to a first article to be bonded, wherein
 the second article to be bonded is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article to be bonded,   the bonding system comprising:
 a device for supplying the second article to be bonded that supplies the second article to be bonded; 
 a bond device that bonds the second article to be bonded to the first article to be bonded by bringing the second article to be bonded into contact with the first article to be bonded; and 
 a device for transporting the second article to be bonded that transports the second article to be bonded, supplied from the device for supplying the second article to be bonded, to the bond device, and 
   the device for transporting the second article to be bonded comprises a holder for the second article to be bonded that holds a portion opposite to the bonding surface in the uneven portion of the second article to be bonded.   
     
     
         23 . A bonding system that bonds a second article to a first article, the bonding system comprising:
 a substrate supporter that holds the first article to be bonded in a posture in which a bonding surface of the first article to be bonded faces vertically downward;   a frame supporter that is placed vertically below the substrate supporter, and that supports a holding frame that holds a sheet to which the second article to be bonded is stuck in a posture in which a bonding surface of the second article to be bonded faces vertically upward;   a head that abuts on a side opposite to a plurality of second articles to be bonded in the sheet; and   a head driver that drives the head in a direction of approaching the substrate supporter, to thereby bond each of the second article to be bonded to the first article to be bonded.   
     
     
         24 . The bonding system according to  claim 23 , wherein
 a first alignment mark is disposed on the first article to be bonded,   a second alignment mark is disposed on the second article to be bonded,   the bonding system further comprising:
 a supporter driver that drives at least one of the substrate supporter and the frame supporter; 
 an imaging device that images the first alignment mark and the second alignment mark from at least one of a side opposite to the second article to be bonded in the first article to be bonded and a side opposite to the first article to be bonded in the second article to be bonded; and 
 a controller that controls the supporter driver and the imaging device, and 
   the controller controls the imaging device to image the first alignment mark and the second alignment mark, calculates an amount of positional deviation of the second article to be bonded from the first article to be bonded based on an imaged photographed image, and then controls the supporter driver to relatively move at least one of the substrate supporter and the frame supporter in a direction in which the amount of the positional deviation of the second article to be bonded from the first article to be bonded is reduced.   
     
     
         25 . The bonding system according to  claim 22 , the bonding system further comprising an activation treatment device that activates a bonding surface of the second article to be bonded. 
     
     
         26 . A bonding method of bonding a second article a first article, the bonding method comprising:
 a first activating step of setting objects including the second article to be bonded on one treatment surface without opposing the objects to each other, and of activating a bonding surface of the second article to be bonded by irradiating a portion formed of a plurality of kinds of materials comprising the bonding surface of the second article to be bonded in the objects with a particle beam; and   a bonding step of bringing the second article to be bonded, of which the bonding surface is activated, into contact with the first article to be bonded, to thereby bond the second article to be bonded to the first article to be bonded.   
     
     
         27 . The bonding method according to  claim 26 , wherein
 in the first activating step, the objects are held in a posture in which the bonding surface of the second article to be bonded faces vertically downward, and the bonding surface of the second article to be bonded is irradiated with the particle beam from vertically below the objects.   
     
     
         28 . The bonding method according to  claim 26 , wherein the particle beam comprises nitrogen. 
     
     
         29 . The bonding method according to  claim 26 , the bonding method further comprising a second activating step of irradiating the bonding surface of the second article to be bonded with a nitrogen radical after the first activating step. 
     
     
         30 . The bonding method according to  claim 26 , wherein hydrophilic bonding of the second article to be bonded to the first article to be bonded is performed in the bonding step. 
     
     
         31 . The bonding method according to  claim 26 , wherein
 an electrode and an insulator film are disposed on the bonding surface of the second article to be bonded, and   the insulator film is formed of an oxide, an oxynitride, or a nitride.   
     
     
         32 . The bonding method according to  claim 26 , wherein in the first activating step, bonding surfaces of a plurality of second articles to be bonded just after dicing a substrate to be diced which is a base material of the second article to be bonded, and in a state of coming into contact with each other or in a state of being connected to each other are activated. 
     
     
         33 . The bonding method according to  claim 26 , the bonding method further comprising a cleaning step of cleaning the bonding surface of the second article to be bonded before the bonding step. 
     
     
         34 . The bonding method according to  claim 33 , wherein
 the first article to be bonded is a substrate,   the second article to be bonded is a chip, and   in the cleaning step, the bonding surface of the second article to be bonded is cleaned in a state in which the second article to be bonded is stuck to a sheet that is formed of a resin and held by a holding frame.   
     
     
         35 . The bonding method according to  claim 34 , wherein
 the second article to be bonded, of which the number is plural, exists,   a plurality of second articles to be bonded is produced by dicing a substrate to be diced, which is a base material of the plurality of second articles to be bonded,   in the cleaning step, the plurality of second articles to be bonded are cleaned in a state in which the plurality of second articles to be bonded just after dicing the substrate to be diced come into contact with each other or are connected to each other, and   the bonding method further comprises a separation step of allowing the plurality of second articles to be bonded to be in a state of being spaced from each other by extending the sheet held by the holding frame before the bonding step.   
     
     
         36 . The bonding method according to  claim 34 , wherein
 the second article to be bonded, of which the number is plural, exists, and   in the cleaning step, a plurality of second articles to be bonded are cleaned with water, and a frame supporter that supports a holding frame that holds a sheet to which the plurality of second articles to be bonded are stuck is then moved relatively with respect to an inner supporter that supports an interior of the holding frame in the sheet held by the holding frame, whereby the inner supporter and the frame supporter are rotated in a state in which a first site, to which the plurality of second articles to be bonded are stuck, in the sheet, and a second site fixed to the holding frame are separated so that the first site is closer to a direction of an axis of rotation of the sheet than the second site, to thereby dry the sheet and the plurality of chips.   
     
     
         37 . The bonding method according to  claim 36 , wherein
 in the cleaning step, the first site in the sheet and the second site fixed to the holding frame are allowed to be in a state of being spaced from each other so that the first site is closer to the direction of the axis of rotation of the sheet than the second site by moving the frame supporter relatively with respect to the inner supporter in a state of sucking the first site in the sheet to which the plurality of second articles to be bonded just after dicing the substrate to be diced, and in a state of coming into contact with each other or in a state of being connected to each other are stuck, from a side opposite to the plurality of second articles to be bonded in the sheet.   
     
     
         38 . The bonding method according to  claim 26 , wherein
 each of the second article to be bonded is a chip comprising an uneven portion on a circumference closer to the bonding surface,   the bonding method further comprising:
 a step of supplying the second article to be bonded, in which the second article to be bonded is supplied; and 
 a step of transporting the second article to be bonded, in which the supplied second article to be bonded is transported, and 
   in the step of transporting the second article to be bonded, a portion opposite to the bonding surface on the uneven portion of the a least one second article to be bonded is held by a holder for the second article to be bonded, and the second article to be bonded is transported.   
     
     
         39 . The bonding method according to  claim 26 , wherein
 the second article to be bonded, of which the number is plural, exists, and   in the bonding step, the second article to be bonded is bonded to the first article to be bonded by moving a head in a direction of approaching the first article to be bonded in a state in which the head is allowed to abut on a side opposite to a plurality of second articles to be bonded in a sheet to which the plurality of second articles to be bonded are stuck.   
     
     
         40 . A bonding method of bonding a second article a first article, wherein
 each second article to be bonded is a chip comprising an uneven portion on a circumference closer to a bonding surface of the second article to be bonded,   the bonding method further comprising:
 a step of transporting the second article to be bonded, in which the second article to be bonded is transported; and 
 a bonding step of bonding the second article to be bonded to the first article to be bonded by bringing the second article to be bonded into contact with the first article to be bonded, and 
   in the step of transporting the second article to be bonded, a portion opposite to the bonding surface on the uneven portion of the second article to be bonded is held by a holder for the second article to be bonded, and the second article to be bonded is transported.   
     
     
         41 . A bonding method of bonding a second article to a first article, the bonding method comprising a bonding step in which the first article to be bonded is held in a posture in which a bonding surface of the first article to be bonded faces vertically downward, a sheet to which the second article to be bonded is stuck in a posture in which a bonding surface of the second article to be bonded faces vertically upward is placed vertically below the first article to be bonded, and the second article to be bonded is bonded to the first article to be bonded by moving a head in a direction of approaching the first article to be bonded in a state in which the head is allowed to abut on a side opposite to the second article to be bonded in the sheet. 
     
     
         42 . The bonding method according to  claim 41 , wherein
 a first alignment mark is disposed on the first article to be bonded,   a second alignment mark is disposed on the second article to be bonded, and   the bonding method further comprising:
 an imaging step of imaging the first alignment mark and the second alignment mark from at least one of a side opposite to the second article to be bonded in the first article to be bonded and a side opposite to the first article to be bonded side in the second article to be bonded by an imaging device; 
 a step of calculating an amount of positional deviation, in which an amount of positional deviation of the second article to be bonded from the first article to be bonded is calculated based on a photographed image imaged in the imaging step; and 
 a movement step of moving the second article to be bonded or the first article to be bonded in a direction in which the amount of the positional deviation of the second article to be bonded from the first article to be bonded is reduced. 
   
     
     
         43 . The bonding method according  claim 40 , the bonding method further comprising a first activating step of activating a bonding surface of the second article to be bonded.