Inventor · disambiguated record
Tadatomo Suga
Also filed as: SUGA TADATOMA · SUGA TADATOMO
43 granted patents·8 pending applications·1,462 citations·filing 2000–2023
98Inventor score
Top patents by PatentIndex Score
51 records- 0199US6472293B2Method for manufacturing an interconnect structure for stacked semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2001·Granted Oct 29, 2002·388 cites·9 claims
- 0299US6465892B1Interconnect structure for stacked semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 15, 2002·636 cites·11 claims
- 0396US9142532B2Chip-on-wafer bonding method and bonding device, and structure comprising chip and waferSUGA TADATOMO·Filed 2013·Granted Sep 22, 2015·25 cites·51 claims
- 0495US7078811B2Semiconductor device and method for fabricating the deviceSUGA TADATOMA·Filed 2001·Granted Jul 18, 2006·160 cites·4 claims
- 0591US7262613B2Inspection method and inspection apparatus for inspecting electrical characteristics of inspection objectTOKYO ELECTRON LTD·Filed 2005·Granted Aug 28, 2007·16 cites·13 claims
- 0690US8091764B2Joining method and device produced by this method and joining unitSUGA TADATOMO·Filed 2010·Granted Jan 10, 2012·13 cites·4 claims
- 0790US7217631B2Semiconductor device and method for fabricating the deviceROHM CO LTD·Filed 2005·Granted May 15, 2007·18 cites·18 claims
- 0889US9870922B2Substrate bonding apparatus and substrate bonding methodSUGA TADATOMO·Filed 2015·Granted Jan 16, 2018·6 cites·25 claims
- 0989US7268430B2Semiconductor device and process for manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted Sep 11, 2007·17 cites·5 claims
- 1081US7784670B2Joining method and device produced by this method and joining unitBONDTECH INC·Filed 2005·Granted Aug 31, 2010·11 cites·23 claims
- 1181US7550366B2Method for bonding substrates and device for bonding substratesAYUMI INDUSTRY·Filed 2005·Granted Jun 23, 2009·18 cites·11 claims
- 1280US12261147B2Bonding system and bonding methodBONDTECH CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·1 claims
- 1380US9601350B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Mar 21, 2017·6 cites·12 claims
- 1479US12388045B2Bonding system and bonding methodBONDTECH CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·19 claims
- 1579US7301243B2High-reliable semiconductor device using hermetic sealing of electrodesSHARP KK·Filed 2005·Granted Nov 27, 2007·9 cites·10 claims
- 1679US6887319B2Residue-free solder pasteSENJU METAL INDUSTRY CO·Filed 2003·Granted May 3, 2005·23 cites·19 claims
- 1779US6777967B2Inspection method and inspection apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Aug 17, 2004·17 cites·3 claims
- 1876US8915418B2Electronic component bonding methodALPHA DESIGN CO LTD·Filed 2014·Granted Dec 23, 2014·5 cites·13 claims
- 1976US7183190B2Semiconductor device and fabrication method thereforTOYO KOHAN CO LTD·Filed 2001·Granted Feb 27, 2007·26 cites·1 claims
- 2073US6935553B2Reflow soldering methodSHINKO SEIKI·Filed 2003·Granted Aug 30, 2005·22 cites·23 claims
- 2172US7686912B2Method for bonding substrates and method for irradiating particle beam to be utilized thereforAYUMI INDUSTRY CO LTD·Filed 2004·Granted Mar 30, 2010·15 cites·7 claims
- 2270US10204785B2Substrate bonding apparatus and substrate bonding methodSUGA TADATOMO·Filed 2017·Granted Feb 12, 2019·1 cites·14 claims
- 2367US12275670B2Method for joining transparent substratesISABERS JAPAN CO LTD·Filed 2019·Granted Apr 15, 2025·0 cites·18 claims
- 2467US7776735B2Semiconductor device and process for manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Aug 17, 2010·3 cites·2 claims
- 2566US6975489B2Circuit structure and semiconductor integrated circuitRENESAS TECH CORP·Filed 2003·Granted Dec 13, 2005·7 cites·30 claims
- 2665US10166749B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Jan 1, 2019·2 cites·13 claims
- 2764US9331305B2Electronic element sealing method and bonded substrateLAN TECHNICAL SERVICE CO LTD·Filed 2013·Granted May 3, 2016·1 cites·17 claims
- 2864US7688088B2Inspection method and inspection apparatus for inspecting electrical characteristics of inspection objectTOKYO ELECTRON LTD·Filed 2008·Granted Mar 30, 2010·1 cites·12 claims
- 2960US8246926B2Fullerene hollow structure needle crystal and C60-C70 mixed fine wire, and method for preparation thereofMIYAZAWA KUN ICHI·Filed 2005·Granted Aug 21, 2012·2 cites·11 claims
- 3058US12409644B2Substrate bonding method and substrate bonding systemBONDTECH CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·15 claims
- 3158US7100279B2Method of mounting an electronic partROHM CO LTD·Filed 2004·Granted Sep 5, 2006·5 cites·1 claims
- 3255US9962908B2Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrateSUGA TADATOMO·Filed 2013·Granted May 8, 2018·0 cites·19 claims
- 3355US2021265300A1Bonding system and bonding methodSUGA TADATOMO·Filed 2018·Application pending·0 cites
- 3454US11849566B2Joint structure, electronic device and method for manufacturing the joint structureDENSO CORP·Filed 2021·Granted Dec 19, 2023·0 cites·5 claims
- 3554US7976814B2Fullerene derivative fine wire and its manufacturing methodNAT INST FOR MATERIAL SCIENCE·Filed 2004·Granted Jul 12, 2011·3 cites·3 claims
- 3654US7061259B2Inspection method and inspection apparatusTOKYO ELECTRON LTD·Filed 2004·Granted Jun 13, 2006·4 cites·4 claims
- 3754US2024274571A1Semiconductor substrate assembly and manufacturing method thereforSUGA TADATOMO·Filed 2022·Application pending·0 cites
- 3852US2024066624A1Bonding method, bonder, and bonding systemSUGA TADATOMO·Filed 2022·Application pending·0 cites
- 3952US2007063725A1Inspection method and inspection apparatus for inspecting electrical characteristics of inspection objectTOKYO ELECTRON LTD·Filed 2006·Application pending·0 cites
- 4049US8651363B2Joining method and device produced by this method and joining unitSUGA TADATOMO·Filed 2011·Granted Feb 18, 2014·0 cites·11 claims
- 4148US11837444B2Substrate joining method, substrate joining system and method for controlling hydrophilic treatment deviceBONDTECH CO LTD·Filed 2017·Granted Dec 5, 2023·0 cites·17 claims
- 4246US7319339B2Inspection apparatus to break the oxide of an electrode by fritting phenomenonTOKYO ELECTRON LTD·Filed 2007·Granted Jan 15, 2008·0 cites·11 claims
- 4345US7591293B2Device for bonding a metal on a surface of a substrateSUGA TADATOMO·Filed 2003·Granted Sep 22, 2009·2 cites·1 claims
- 4444US7304489B2Inspection method and inspection apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Dec 4, 2007·0 cites·6 claims
- 4543US8875977B2Element pressing apparatus and heating system using element pressing apparatusALPHA DESIGN CO LTD·Filed 2014·Granted Nov 4, 2014·0 cites·5 claims
- 4642US12351511B2Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminateISABERS JAPAN CO LTD·Filed 2018·Granted Jul 8, 2025·0 cites·20 claims
- 4740US10043975B2Thin substrate, method for manufacturing same, and method for transporting substrateLAN TECHNICAL SERVICE CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·36 claims
- 4838US2003164396A1Mounting method and deviceFiled 2001·Application pending·0 cites
- 4936US2003164394A1Installation deviceFiled 2001·Application pending·0 cites
- 5035US2003168145A1Method and apparatus for mountingFiled 2001·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →