Inventor · disambiguated record
Akira Yamauchi
Also filed as: TAKEUCHI LEGAL REPRESENTATIVE · YAMAUCHI AKIRA
101 granted patents·42 pending applications·1,879 citations·filing 1974–2025
99Inventor score
Top patents by PatentIndex Score
143 records- 0196US10580752B2Method for bonding substrates together, and substrate bonding deviceBONDTECH CO LTD·Filed 2015·Granted Mar 3, 2020·9 cites·23 claims
- 0296US9142532B2Chip-on-wafer bonding method and bonding device, and structure comprising chip and waferSUGA TADATOMO·Filed 2013·Granted Sep 22, 2015·25 cites·51 claims
- 0395US6563244B1Composite-type electromagnet and radial magnetic bearingSEIKO INSTR INC·Filed 2000·Granted May 13, 2003·57 cites·13 claims
- 0493US6932402B2Console boxTOYODA GOSEI KK·Filed 2003·Granted Aug 23, 2005·66 cites·21 claims
- 0593US5661823AImage data processing apparatus that automatically sets a data compression rateTOSHIBA KK·Filed 1993·Granted Aug 26, 1997·145 cites·4 claims
- 0693US4206514ASanitary footgear articlesYAMAUCHI AKIRA·Filed 1977·Granted Jun 10, 1980·57 cites·4 claims
- 0792US6703549B1Performance data generating apparatus and method and storage mediumYAMAHA CORP·Filed 2000·Granted Mar 9, 2004·81 cites·114 claims
- 0892US6020982AImage data processing apparatus for digitally reproducing optical image dataTOSHIBA KK·Filed 1993·Granted Feb 1, 2000·118 cites·5 claims
- 0990US6140565AMethod of visualizing music system by combination of scenery picture and player iconsYAMAHA CORP·Filed 1999·Granted Oct 31, 2000·149 cites·44 claims
- 1090US3931886AInner bag for containersYAMAUCHI AKIRA·Filed 1974·Granted Jan 13, 1976·78 cites·4 claims
- 1189US11587804B2Component mounting systemBONDTECH CO LTD·Filed 2018·Granted Feb 21, 2023·5 cites·26 claims
- 1289US9870922B2Substrate bonding apparatus and substrate bonding methodSUGA TADATOMO·Filed 2015·Granted Jan 16, 2018·6 cites·25 claims
- 1389US7004527B2Console boxTOYODA GOSEI KK·Filed 2005·Granted Feb 28, 2006·31 cites·9 claims
- 1489US6617733B1Magnetic bearing apparatus and vacuum pump having magnetic bearing apparatusSEIKO INSTR INC·Filed 2000·Granted Sep 9, 2003·43 cites·20 claims
- 1588US9243894B2Pressure application apparatus and pressure application methodYAMAUCHI AKIRA·Filed 2010·Granted Jan 26, 2016·9 cites·27 claims
- 1688US6156845APolyolefin composition and method of makingCHISSO CORP·Filed 1996·Granted Dec 5, 2000·53 cites·33 claims
- 1787US6437048B1Molded resin articlesCHISSO CORP·Filed 1996·Granted Aug 20, 2002·62 cites·43 claims
- 1886US5117730AString type tone signal controlling deviceYAMAHA CORP·Filed 1990·Granted Jun 2, 1992·51 cites·9 claims
- 1986US3970690AMethod for preparing dispersing agentKUREHA CHEMICAL IND CO LTD·Filed 1974·Granted Jul 20, 1976·20 cites·1 claims
- 2084US6231804B1Modified olefin (co)polymer composition, process for preparing the same, and modified olefin (co)polymer composition moldingCHISSO CORP·Filed 1998·Granted May 15, 2001·45 cites·30 claims
- 2183US12094747B2Substrate bonding deviceBONDTECH CO LTD·Filed 2019·Granted Sep 17, 2024·3 cites·4 claims
- 2283US6313387B1Apparatus and method for editing a music score based on an intermediate data set including note data and sign dataYAMAHA CORP·Filed 2000·Granted Nov 6, 2001·27 cites·14 claims
- 2383US5814427ADecolorizable toner and process for preparing the sameBANDO CHEMICAL IND·Filed 1994·Granted Sep 29, 1998·29 cites·9 claims
- 2482US5616879AElectronic musical instrument system formed of dynamic network of processing unitsYAMAHA CORP·Filed 1995·Granted Apr 1, 1997·64 cites·7 claims
- 2580US12261147B2Bonding system and bonding methodBONDTECH CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·1 claims
- 2680US9601350B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Mar 21, 2017·6 cites·12 claims
- 2779US12388045B2Bonding system and bonding methodBONDTECH CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·19 claims
- 2879US6796481B2Chip mounting methodTORAY ENG CO LTD·Filed 2000·Granted Sep 28, 2004·22 cites·10 claims
- 2979US6770992B2Magnetic bearing apparatusBOC EDWARDS JAPAN LTD·Filed 2001·Granted Aug 3, 2004·16 cites·14 claims
- 3079US6575713B2Vaccum pumpSEIKO INSTR INC·Filed 2000·Granted Jun 10, 2003·27 cites·12 claims
- 3178US6736593B2Protective device for a turbo molecular pump and method of protecting a turbo molecular pumpBOC TECHNOLOGIES LTD·Filed 2002·Granted May 18, 2004·25 cites·8 claims
- 3277US6295139B1Image data processing apparatus for processing and transferring data from memory cards to external devicesTOSHIBA KK·Filed 1994·Granted Sep 25, 2001·35 cites·8 claims
- 3376US6892447B1Chip mounting deviceTORAY ENG CO LTD·Filed 2000·Granted May 17, 2005·17 cites·31 claims
- 3476US6416290B1Turbo molecular pumpSEIKO INSTR INC·Filed 1998·Granted Jul 9, 2002·41 cites·19 claims
- 3576US6303696B1Propylene (co)polymer composition using metallocene catalystCHISSO CORP·Filed 1998·Granted Oct 16, 2001·29 cites·12 claims
- 3675US9379082B2Pressure application apparatus and pressure application methodBONDTECH CO LTD·Filed 2015·Granted Jun 28, 2016·2 cites·18 claims
- 3775US6821381B1Tool for thermo-compression-bonding chips, and chip packaging device having the sameTORAY ENG CO LTD·Filed 2000·Granted Nov 23, 2004·22 cites·21 claims
- 3872US12341036B2Resin shaping deviceBONDTECH CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·17 claims
- 3970US10204785B2Substrate bonding apparatus and substrate bonding methodSUGA TADATOMO·Filed 2017·Granted Feb 12, 2019·1 cites·14 claims
- 4070US7918953B2Alignment method and mounting method using the alignment methodTORAY ENG CO LTD·Filed 2007·Granted Apr 5, 2011·3 cites·20 claims
- 4170US5286916AMusical tone signal synthesizing apparatus employing selective excitation of closed loopYAMAHA CORP·Filed 1992·Granted Feb 15, 1994·22 cites·29 claims
- 4269US8908886B2Power amplifying apparatus and audio systemYAMAUCHI AKIRA·Filed 2012·Granted Dec 9, 2014·4 cites·20 claims
- 4369US5973468AMagnetic bearing devicesSEIKO SEIKI KK·Filed 1997·Granted Oct 26, 1999·23 cites·10 claims
- 4469US2025210185A1Facility presentation apparatus, facility presentation method and recording mediumNEC CORP·Filed 2025·Application pending·0 cites
- 4569US2025218581A1Facility presentation apparatus, facility presentation method and recording mediumNEC CORP·Filed 2025·Application pending·0 cites
- 4669US2025218582A1Facility presentation apparatus, facility presentation method and recording mediumNEC CORP·Filed 2025·Application pending·0 cites
- 4766US6459028B2Performance data modifying method, performance data modifying apparatus, and storage mediumYAMAHA CORP·Filed 2001·Granted Oct 1, 2002·4 cites·19 claims
- 4865US10166749B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Jan 1, 2019·2 cites·13 claims
- 4965US2023002528A1Copolymer, Resin Composition, Molded Product, Filmy Molded Product, and Method for Producing CopolymerMITSUBISHI CHEM CORP·Filed 2022·Application pending·0 cites
- 5064US6679677B2Vacuum pumpSEIKO INSTR INC·Filed 2002·Granted Jan 20, 2004·12 cites·20 claims
Showing the top 50 of 143 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Akira Yamauchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →