Assignee
SUGO YUKI
JP·2 granted patents·4 pending applications·2 citations·filing 2009–2012
Top patents by PatentIndex Score
6 records- 0161US8143106B2Thermosetting die-bonding filmSUGO YUKI·Filed 2009·Granted Mar 27, 2012·2 cites·11 claims
- 0247US8580617B2Thermosetting die-bonding filmSUGO YUKI·Filed 2012·Granted Nov 12, 2013·0 cites·12 claims
- 0333US2011052853A1Adhesive film with dicing sheet and method of manufacturing the sameSUGO YUKI·Filed 2010·Application pending·0 cites
- 0433US2011120614A1Thermosetting adhesive film, adhesive film with dicing film, and method of manufacturing semiconductor device using the thermosetting adhesive film or the adhesive film with dicing filmSUGO YUKI·Filed 2010·Application pending·0 cites
- 0531US2011256666A1Thermosetting die bond film, dicing die bond film and semiconductor deviceSUGO YUKI·Filed 2011·Application pending·0 cites
- 0631US2011189835A1Film for manufacturing semiconductor device and method of manufacturing semiconductor deviceSUGO YUKI·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →