US8580617B2ActiveUtilityA1
Thermosetting die-bonding film
Est. expiryAug 28, 2028(~2.1 yrs left)· nominal 20-yr term from priority
H10W 72/5524H10W 72/5522H10W 74/00H10W 72/075H10W 72/884H10W 90/754H10W 90/00H10W 72/07533H10W 72/07504H10W 72/07338H10W 72/073H10W 72/353H10W 72/354H10W 72/325H10W 72/352H10W 72/322H10W 72/30H10W 72/01331H10W 72/381H10W 90/734H10W 90/732H10P 72/7416H10W 72/5525H10P 72/7402C08L 33/06C08G 59/621C08L 2666/04C09J 163/00B32B 27/42B32B 27/30B32B 27/38Y10T428/31511
47
PatentIndex Score
0
Cited by
27
References
12
Claims
Abstract
The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A thermosetting die-bonding film that is used in manufacturing a semiconductor device,
comprising at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler, wherein the epoxy resin, phenol resin, and acrylic copolymer are characterized by a ratio X/Y of 1 to 5 when X represents a total weight of the epoxy resin and the phenol resin and where Y represents a weight of the acrylic copolymer,
the thermosetting die-bonding film is further characterized as having a melt viscosity at 120 to 130° C. in the range of 500 to 3500 Pa·s,
the acrylic copolymer comprises 10 to 60% by weight of butyl acrylate and 40 to 90% by weight of ethyl acrylate, and
the filler is present in an amount of 18 parts by weight to 80 parts by weight relative to 100 parts of a total weight of the epoxy resin, the phenol resin and the acrylic copolymer.
2. The thermosetting die-bonding film according to claim 1 , wherein
the acrylic copolymer is further characterized as having a glass transition point in the range of −30 to 30° C.
3. The thermosetting die-bonding film according to claim 1 , wherein
the epoxy resin is further characterized as having a melt viscosity at 120 to 130° C. in the range of 0.05 to 7 Pa·s.
4. The thermosetting die-bonding film according to claim 1 , wherein
the phenol resin is further characterized as having a melt viscosity at 120 to 130° C. in the range of 0.3 to 35 Pa·s.
5. A dicing die-bonding film having a structure in which the thermosetting die-bonding film according to claim 1 is laminated on a dicing film.
6. The thermosetting die-bonding film according to claim 2 , wherein
the epoxy resin is further characterized as having a melt viscosity at 120 to 130° C. in the range of 0.05 to 7 Pa·s.
7. The thermosetting die-bonding film according to claim 2 , wherein
the phenol resin is further characterized as having a melt viscosity at 120 to 130° C. in the range of 0.3 to 35 Pa·s.
8. The thermosetting die-bonding film according to claim 3 , wherein
the phenol resin is further characterized as having a melt viscosity at 120 to 130° C. in the range of 0.3 to 35 Pa·s.
9. The thermosetting die-bonding film according to claim 6 , wherein
the phenol resin is further characterized as having a melt viscosity at 120 to 130° C. in the range of 0.3 to 35 Pa·s.
10. A dicing die-bonding film having a structure in which the thermosetting die-bonding film according to claim 2 is laminated on a dicing film.
11. A dicing die-bonding film having a structure in which the thermosetting die-bonding film according to claim 3 is laminated on a dicing film.
12. A dicing die-bonding film having a structure in which the thermosetting die-bonding film according to claim 4 is laminated on a dicing film.Cited by (0)
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