Inventor · disambiguated record
Sadahito Misumi
Also filed as: MISUMI SADAHITO
31 granted patents·7 pending applications·312 citations·filing 1999–2013
97Inventor score
Top patents by PatentIndex Score
38 records- 0198US7508081B2Dicing die-bonding filmNITTO DENKO CORP·Filed 2005·Granted Mar 24, 2009·30 cites·12 claims
- 0295US7863182B2Dicing die-bonding filmNITTO DENKO CORP·Filed 2009·Granted Jan 4, 2011·23 cites·16 claims
- 0387US6492484B2PolycarbodiimideNITTO DENKO CORP·Filed 2001·Granted Dec 10, 2002·25 cites·13 claims
- 0482US8304341B2Dicing die-bonding filmMATSUMURA TAKESHI·Filed 2011·Granted Nov 6, 2012·5 cites·16 claims
- 0582USD549189SDicing die-bonding filmNITTO DENKO CORP·Filed 2005·Granted Aug 21, 2007·29 cites·1 claims
- 0680US7449226B2Dicing die-bonding film, method of fixing chipped work and semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Nov 11, 2008·20 cites·16 claims
- 0780US6896994B2Battery separator containing carbodiimide polymerNITTO DENKO CORP·Filed 2001·Granted May 24, 2005·19 cites·2 claims
- 0879US8278153B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyMISUMI SADAHITO·Filed 2010·Granted Oct 2, 2012·4 cites·16 claims
- 0979US7772040B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyNITTO DENKO CORP·Filed 2007·Granted Aug 10, 2010·6 cites·16 claims
- 1078USD589473SAdhesive film material for use in manufacturing semiconductorsNITTO DENKO CORP·Filed 2007·Granted Mar 31, 2009·23 cites·1 claims
- 1176US6248857B1Aromatic polycarbodiimide and polycarbodiimide sheetNITTO DENKO CORP·Filed 1999·Granted Jun 19, 2001·16 cites·9 claims
- 1275US7780811B2Dicing die-bonding film, method of fixing chipped work and semiconductor deviceNITTO DENKO CORP·Filed 2007·Granted Aug 24, 2010·4 cites·7 claims
- 1374US6652688B2Process for producing semiconductor wafer with adhesive filmNITTO DENKO CORP·Filed 2002·Granted Nov 25, 2003·21 cites·10 claims
- 1473US8236614B2Semiconductor device manufacturing methodMISUMI SADAHITO·Filed 2006·Granted Aug 7, 2012·5 cites·14 claims
- 1573US6228972B1Aromatic polycarbodiimide and water repellent sheet made therefromNITTO DENKO CORP·Filed 1999·Granted May 8, 2001·23 cites·14 claims
- 1672US8703584B2Dicing tape-integrated film for semiconductor back surfaceMISUMI SADAHITO·Filed 2010·Granted Apr 22, 2014·4 cites·5 claims
- 1772US7611926B2Thermosetting die bonding filmNITTO DENKO CORP·Filed 2008·Granted Nov 3, 2009·6 cites·15 claims
- 1871US6669869B2Anisotropic conductive filmNITTO DENKO CORP·Filed 2002·Granted Dec 30, 2003·17 cites·14 claims
- 1968US7232709B2Process for producing a semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Jun 19, 2007·14 cites·15 claims
- 2063US6811927B1Battery containing a polycarbodiimide polymerNITTO DENKO CORP·Filed 2001·Granted Nov 2, 2004·5 cites·13 claims
- 2161US8143106B2Thermosetting die-bonding filmSUGO YUKI·Filed 2009·Granted Mar 27, 2012·2 cites·11 claims
- 2260US6414105B2Aromatic polycarbodiimide and sheet thereofNITTO DENKO CORP·Filed 2001·Granted Jul 2, 2002·4 cites·19 claims
- 2359US9105754B2Adhesive film, method of manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Aug 11, 2015·1 cites·10 claims
- 2458US7998552B2Dicing/die bonding filmNITTO DENKO CORP·Filed 2008·Granted Aug 16, 2011·1 cites·11 claims
- 2553US8975759B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyMISUMI SADAHITO·Filed 2012·Granted Mar 10, 2015·0 cites·7 claims
- 2650US2009001611A1Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the methodMATSUMURA TAKESHI·Filed 2007·Application pending·0 cites
- 2750US2004230000A1Adhesives composition, adhesive film, and semiconductor apparatus using the sameFiled 2003·Application pending·0 cites
- 2848US9153556B2Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the methodMATSUMURA TAKESHI·Filed 2010·Granted Oct 6, 2015·0 cites·2 claims
- 2948US2012189845A1Semiconductor device manufacturing methodMISUMI SADAHITO·Filed 2012·Application pending·0 cites
- 3047US8580617B2Thermosetting die-bonding filmSUGO YUKI·Filed 2012·Granted Nov 12, 2013·0 cites·12 claims
- 3146US2010236689A1Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 3243US8890190B2Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection componentITO HISATAKA·Filed 2012·Granted Nov 18, 2014·0 cites·4 claims
- 3343US2010019365A1Dicing/die bonding filmNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 3442US8642362B2Method for producing light-emitting diode deviceITO HISATAKA·Filed 2012·Granted Feb 4, 2014·0 cites·2 claims
- 3542US8592260B2Process for producing a semiconductor deviceOIKAWA MASAMI·Filed 2009·Granted Nov 26, 2013·0 cites·15 claims
- 3639US2003068841A1Process of producing semiconductor device and resin composition sheet used thereforNITTO DENKO CORP·Filed 2002·Application pending·0 cites
- 3739US2010219507A1Process for producing semiconductor deviceMISUMI SADAHITO·Filed 2007·Application pending·0 cites
- 3833US6410615B1Semiconductor sealing epoxy resin composition and semiconductor device using the sameNITTO DENKO CORP·Filed 1999·Granted Jun 25, 2002·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →