Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

Abstract

The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less.

1 . An adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, wherein a 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less. 
     
     
         2 . The adhesive sheet for manufacturing a semiconductor device according to  claim 1 , wherein the adhesive sheet is comprised of a thermosetting resin. 
     
     
         3 . The adhesive sheet for manufacturing a semiconductor device according to  claim 2 , wherein the thermosetting resin includes an epoxy resin and/or a phenol resin. 
     
     
         4 . The adhesive sheet for manufacturing a semiconductor device according to  claim 1 , wherein the adhesive sheet is comprised of a thermosetting resin and a thermoplastic resin. 
     
     
         5 . The adhesive sheet for manufacturing a semiconductor device according to  claim 4 , wherein the thermosetting resin includes an epoxy resin and/or a phenol resin. 
     
     
         6 . The adhesive sheet for manufacturing a semiconductor device according to  claim 4 , wherein the thermoplastic resin includes an acrylic resin. 
     
     
         7 . The adhesive sheet for manufacturing a semiconductor device according to  claim 1 , wherein the adhesive sheet is comprised of an epoxy resin, a phenol resin, and an acrylic resin, and the weight ratio of the acrylic resin to the epoxy resin and the phenol resin is larger than 50%. 
     
     
         8 . A manufacturing method of a semiconductor device, including
 a step of fixing a semiconductor element onto an adherend interposing the adhesive sheet for manufacturing a semiconductor device according to  claim 1 ,   a step of bonding wires to the semiconductor device, and   a step of resin-sealing the semiconductor element with a sealing resin, wherein   in the case of trouble occurring in the step of fixing, the semiconductor element is peeled off from the adhesive sheet and the step of fixing is repeated using another adhesive sheet.   
     
     
         9 . The manufacturing method of a semiconductor device according to  claim 8 , wherein the step of fixing is performed at 70° C. or less. 
     
     
         10 . A semiconductor device obtained by the manufacturing method of a semiconductor device according to  claim 8 . 
     
     
         11 . A method of manufacturing a semiconductor device comprising:
 fixing a semiconductor element to an adherend using the adhesive sheet for manufacturing a semiconductor element according to  claim 1 , wherein said adhesive sheet for manufacturing a semiconductor element is removably attached to said semiconductor element such that removal of said adhesive sheet from said semiconductor element does not damage said semiconductor element;   bonding wires to the semiconductor element; and   resin-sealing the semiconductor element with a sealing resin.   
     
     
         12 . The method of  claim 11  wherein said property of said adhesive sheet for manufacturing a semiconductor element being removably attached to said semiconductor element such that removal of said adhesive sheet for manufacturing a semiconductor element from said semiconductor element does not damage said semiconductor element is defined by a method comprising:
 fixing an adhesive sheet 25 mm in width to a silicon wafer;   maintaining the adhesive sheet fixed to said silicon wafer for 30 minutes; and   peeling the adhesive sheet from said silicon wafer at a peeling angle of 180 degrees and at a peeling speed of 300 mm/min,   wherein the adhesive sheet's 180 degree peeling adhesive strength against the silicon wafer of 5 (N/25 mm width) or less is indicative that the adhesive sheet is removably attachable to a semiconductor element such that removal of the adhesive sheet from the semiconductor element does not damage said semiconductor element.   
     
     
         13 . The adhesive sheet for manufacturing a semiconductor device according to  claim 1 , wherein the 180 degree peeling adhesive strength against a silicon wafer is 3.0 to 0.5 (N/25 mm width). 
     
     
         14 . The adhesive sheet for manufacturing a semiconductor device according to  claim 3 , wherein the thermosetting resin includes an epoxy resin and a phenol resin, and the phenol resin is blended with the epoxy resin in such a manner that the ratio of hydroxyl group equivalents in the phenol resin component per equivalent of the epoxy groups in the epoxy resin component is 0.5 to 2.0. 
     
     
         15 . The adhesive sheet for manufacturing a semiconductor device according to  claim 1 , wherein the adhesive sheet comprises a cross-linking agent.