Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

Abstract

The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less.

What is claimed is: 
     
       1. A method of manufacturing a semiconductor device, comprising:
 fixing a semiconductor element to an adherend using an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, wherein a 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less, wherein said adhesive sheet for manufacturing a semiconductor element is removably attached to said semiconductor element such that removal of said adhesive sheet from said semiconductor element does not damage said semiconductor element; 
 peeling the adhesive sheet from the semiconductor element without damaging the semiconductor element; 
 bonding wires to the semiconductor element after peeling the adhesive sheet from the semiconductor element; and 
 resin-sealing the semiconductor element with a sealing resin, 
 wherein the adherend is a substrate, lead frame, or semiconductor element. 
 
     
     
       2. A method of manufacturing a semiconductor device of comprising:
 fixing a semiconductor element to an adherend using an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, wherein a 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less, wherein said adhesive sheet for manufacturing a semiconductor element is removably attached to said semiconductor element such that removal of said adhesive sheet from said semiconductor element does not damage said semiconductor element; 
 peeling the adhesive sheet from the semiconductor element without damaging the semiconductor element to remove the adhesive sheet from the semiconductor element and repeating the fixing step using a second adhesive sheet having the same properties as the removed adhesive sheet; 
 bonding wires to the semiconductor element after peeling the adhesive sheet from the semiconductor element; and 
 resin-sealing the semiconductor element with a sealing resin, 
 wherein the adherend is a substrate, lead frame, or semiconductor element.