Assignee
TSAI SHIANN-TSONG
TW·4 granted patents·2 pending applications·2 citations·filing 2011–2020
Top patents by PatentIndex Score
6 records- 0178US11239179B2Semiconductor package and fabrication method thereofTSAI SHIANN TSONG·Filed 2020·Granted Feb 1, 2022·1 cites·31 claims
- 0271US10923435B2Semiconductor package with in-package compartmental shielding and improved heat-dissipation performanceTSAI SHIANN TSONG·Filed 2020·Granted Feb 16, 2021·1 cites·14 claims
- 0343US10896880B2Semiconductor package with in-package compartmental shielding and fabrication method thereofTSAI SHIANN TSONG·Filed 2019·Granted Jan 19, 2021·0 cites·26 claims
- 0441US11211340B2Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shieldingTSAI SHIANN TSONG·Filed 2019·Granted Dec 28, 2021·0 cites·21 claims
- 0541US2015105889A1Cloud 3d model construction system and construction method thereofTSAI SHIANN-TSONG·Filed 2013·Application pending·0 cites
- 0637US2012220081A1Method of fabricating a semiconductor package structureTSAI SHIANN-TSONG·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →