Assignee
TSAI TSUNG-FU
TW·5 granted patents·2 pending applications·41 citations·filing 2009–2012
Top patents by PatentIndex Score
7 records- 0194US8581420B2Under-bump metallization (UBM) structure and method of forming the sameTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·21 cites·20 claims
- 0283US8130509B2Package carrierTSAI TSUNG-FU·Filed 2009·Granted Mar 6, 2012·11 cites·23 claims
- 0380US9064881B2Protecting flip-chip package using pre-applied filletTSAI TSUNG-FU·Filed 2010·Granted Jun 23, 2015·4 cites·20 claims
- 0477US8581399B2Metal bump structureTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·5 cites·19 claims
- 0546US2013087925A1Packaging Structures of Integrated CircuitsTSAI TSUNG-FU·Filed 2011·Application pending·0 cites
- 0645US2012125669A1Package carrierTSAI TSUNG-FU·Filed 2012·Application pending·0 cites
- 0737US8575754B2Micro-bump structureTSAI TSUNG-FU·Filed 2010·Granted Nov 5, 2013·0 cites·6 claims
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