Assignee
UNICAP ELECTRONICS IND CORP
TW·2 granted patents·2 pending applications·55 citations·filing 2000–2004
Top patents by PatentIndex Score
4 records- 0183US6711812B1Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packagesUNICAP ELECTRONICS IND CORP·Filed 2000·Granted Mar 30, 2004·47 cites·11 claims
- 0254US6675472B1Process and structure for manufacturing plastic chip carrierUNICAP ELECTRONICS IND CORP·Filed 2000·Granted Jan 13, 2004·8 cites·8 claims
- 0336US2004163248A1Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and methodUNICAP ELECTRONICS IND CORP·Filed 2004·Application pending·0 cites
- 0434US2004141299A1Burrless castellation via process and product for plastic chip carrierUNICAP ELECTRONICS IND CORP·Filed 2004·Application pending·0 cites
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