Assignee
UNIMICRON TECHNOLOGY CORP
TW·383 granted patents·140 pending applications·1,146 citations·filing 2001–2025
Top patents by PatentIndex Score
523 records- 0197US8999759B2Method for fabricating packaging structure having embedded semiconductor elementUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Apr 7, 2015·40 cites·11 claims
- 0297US7839649B2Circuit board structure having embedded semiconductor element and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Nov 23, 2010·54 cites·14 claims
- 0396US11690173B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jun 27, 2023·4 cites·8 claims
- 0496US6506632B1Method of forming IC package having downward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·164 cites·22 claims
- 0595US11516910B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·4 cites·10 claims
- 0695US10888001B2Circuit carrier board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 5, 2021·14 cites·12 claims
- 0795US9635757B1Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Apr 25, 2017·17 cites·9 claims
- 0894US12309943B2Circuit carrier and manufacturing method thereof and package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·2 cites·17 claims
- 0994US11579178B1Inspection apparatus for bare circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 14, 2023·8 cites·10 claims
- 1094US10939538B1Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 2, 2021·5 cites·12 claims
- 1194US9514629B2Vehicle door opening warning system and vehicle door opening warning methodUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Dec 6, 2016·27 cites·8 claims
- 1293US9609746B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Mar 28, 2017·9 cites·7 claims
- 1392US12412879B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Sep 9, 2025·1 cites·13 claims
- 1492US11808787B2Probe card testing deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 7, 2023·3 cites·13 claims
- 1592US10039184B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Jul 31, 2018·9 cites·6 claims
- 1692US9491865B1Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Nov 8, 2016·8 cites·4 claims
- 1792US9374896B2Packaging carrier and manufacturing method thereof and chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Jun 21, 2016·12 cites·6 claims
- 1892US8736033B1Embedded electronic device package structureUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted May 27, 2014·42 cites·10 claims
- 1991US11335670B2Light emitting diode package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted May 17, 2022·3 cites·11 claims
- 2091US10461146B1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Oct 29, 2019·10 cites·10 claims
- 2191US6506633B1Method of fabricating a multi-chip module packageUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·81 cites·26 claims
- 2290US10993358B1Device for removing portion of cover and method of removing portion of coverUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Apr 27, 2021·3 cites·11 claims
- 2390US9854671B1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 26, 2017·4 cites·10 claims
- 2490US7969745B2Circuit board structure having electronic components integrated thereinUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Jun 28, 2011·21 cites·19 claims
- 2590US7968991B2Stacked package module and board having exposed endsUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jun 28, 2011·32 cites·16 claims
- 2689US11410971B2Chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 9, 2022·2 cites·11 claims
- 2789US11139234B1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 5, 2021·2 cites·5 claims
- 2889US6709897B2Method of forming IC package having upward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Mar 23, 2004·64 cites·30 claims
- 2988US11430768B2Stacked die chip package structure and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 30, 2022·2 cites·19 claims
- 3088US9357659B2Packaging substrate having embedded through-via interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 31, 2016·5 cites·6 claims
- 3188US8580608B2Fabrication method of package structure having embedded semiconductor componentUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Nov 12, 2013·8 cites·7 claims
- 3288US7906850B2Structure of circuit board and method for fabricating sameUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Mar 15, 2011·19 cites·3 claims
- 3387US9161454B2Electrical device package structure and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2012·Granted Oct 13, 2015·8 cites·4 claims
- 3487US8017442B2Method of fabricating a package structureUNIMICRON TECHNOLOGY CORP·Filed 2010·Granted Sep 13, 2011·9 cites·16 claims
- 3587US7700986B2Chip package carrier and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Apr 20, 2010·17 cites·22 claims
- 3686US10356901B2Manufacturing method of circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jul 16, 2019·4 cites·8 claims
- 3786US10123418B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Nov 6, 2018·5 cites·20 claims
- 3885US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 3985US9860984B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 2, 2018·3 cites·12 claims
- 4085US9340003B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted May 17, 2016·8 cites·7 claims
- 4185US9337136B2Method of fabricating a through-holed interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 10, 2016·4 cites·3 claims
- 4284US11460255B2Vapor chamber device and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
- 4384US10660202B1Carrier structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 19, 2020·4 cites·14 claims
- 4484US10575397B1Circuit carrier structure, manufacturing method thereof and chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Feb 25, 2020·3 cites·10 claims
- 4584US10056356B1Chip package circuit board moduleUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Aug 21, 2018·5 cites·8 claims
- 4684US9860980B1Circuit board elementUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 2, 2018·4 cites·10 claims
- 4784US7987589B2Multilayer three-dimensional circuit structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Aug 2, 2011·10 cites·19 claims
- 4883US10433413B2Manufacturing method of circuit structure embedded with heat-dissipation blockUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Oct 1, 2019·5 cites·3 claims
- 4983US8033014B2Method of making a molded interconnect deviceUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Oct 11, 2011·14 cites·12 claims
- 5083US7948085B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted May 24, 2011·12 cites·6 claims
Showing the top 50 of 523 patent records by PatentIndex Score.
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