Assignee
UNIV TOHOKU NAT UNIV CORP
JP·12 granted patents·19 pending applications·79 citations·filing 2005–2015
Top patents by PatentIndex Score
31 records- 0195US7518143B2Solid-state imaging device, line sensor and optical sensor and method of operating solid-state imaging deviceUNIV TOHOKU NAT UNIV CORP·Filed 2005·Granted Apr 14, 2009·23 cites·6 claims
- 0292US7800673B2Solid-state imaging device, optical sensor and method of operating solid-state imaging deviceUNIV TOHOKU NAT UNIV CORP·Filed 2005·Granted Sep 21, 2010·28 cites·2 claims
- 0382US7863925B2Test circuit, wafer, measuring apparatus, and measuring methodUNIV TOHOKU NAT UNIV CORP·Filed 2007·Granted Jan 4, 2011·5 cites·18 claims
- 0482US7820467B2Imaging device and method that cancels voltage signal noise based on pre-saturated charges and supersaturated chargesUNIV TOHOKU NAT UNIV CORP·Filed 2009·Granted Oct 26, 2010·5 cites·4 claims
- 0579US7812595B2Electronic device identifying methodUNIV TOHOKU NAT UNIV CORP·Filed 2008·Granted Oct 12, 2010·7 cites·8 claims
- 0677US7848828B2Method and apparatus for managing manufacturing equipment, method for manufacturing device therebyUNIV TOHOKU NAT UNIV CORP·Filed 2008·Granted Dec 7, 2010·5 cites·22 claims
- 0769US7965097B2Test circuit, wafer, measuring apparatus, measuring method, device manufacturing method and display apparatusUNIV TOHOKU NAT UNIV CORP·Filed 2010·Granted Jun 21, 2011·1 cites·8 claims
- 0866US8362567B2Semiconductor deviceUNIV TOHOKU NAT UNIV CORP·Filed 2007·Granted Jan 29, 2013·3 cites·20 claims
- 0961US7977796B2Semiconductor device and multilayer wiring boardUNIV TOHOKU NAT UNIV CORP·Filed 2007·Granted Jul 12, 2011·1 cites·10 claims
- 1061US7923819B2Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2007·Granted Apr 12, 2011·1 cites·16 claims
- 1156US2011248323A1Ion implantation apparatus, ion implantation method, and semiconductor deviceUNIV TOHOKU NAT UNIV CORP·Filed 2009·Application pending·0 cites
- 1254US2011000533A1Photoelectric conversion element structure and solar cellUNIV TOHOKU NAT UNIV CORP·Filed 2009·Application pending·0 cites
- 1353US2010231118A1Cathode body and fluorescent tube using the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 1453US2014151853A1Ion Implantation Apparatus, Ion Implantation Method, and Semiconductor DeviceUNIV TOHOKU NAT UNIV CORP·Filed 2014·Application pending·0 cites
- 1552US2011212552A1Device manufacturing methodUNIV TOHOKU NAT UNIV CORP·Filed 2011·Application pending·0 cites
- 1652US2011209567A1Display apparatusUNIV TOHOKU NAT UNIV CORP·Filed 2011·Application pending·0 cites
- 1750US9332957B2Evaluation aidUNIV TOHOKU NAT UNIV CORP·Filed 2015·Granted May 10, 2016·0 cites·12 claims
- 1850US2009135109A1Organic el element, organic el display device, and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 1950US2011215384A1Semiconductor device and method of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 2049US2007181531A1Plasma processing apparatus and plasma processing methodUNIV TOHOKU NAT UNIV CORP·Filed 2007·Application pending·0 cites
- 2148US7994063B2Method for manufacturing semiconductor device and method for cleaning semiconductor substrateUNIV TOHOKU NAT UNIV CORP·Filed 2009·Granted Aug 9, 2011·0 cites·24 claims
- 2247US2013031945A1Metalworking machineUNIV TOHOKU NAT UNIV CORP·Filed 2011·Application pending·0 cites
- 2347US2009246524A1Porous calcium oxide particulate and porous calcium hydroxide particulateUNIV TOHOKU NAT UNIV CORP·Filed 2007·Application pending·0 cites
- 2445US2010101834A1Interlayer insulation film, interconnect structure, and methods of manufacturing themUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 2545US2009277379A1Film coating apparatusUNIV TOHOKU NAT UNIV CORP·Filed 2007·Application pending·0 cites
- 2644US2011127075A1Interlayer insulating film, wiring structure, and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 2743US2010044846A1Three-dimensional structural semiconductor deviceUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 2843US2009269573A1High-Performance Composite Material and Manufacturing Method thereofUNIV TOHOKU NAT UNIV CORP·Filed 2006·Application pending·0 cites
- 2940US2010193900A1Soi substrate and semiconductor device using an soi substrateUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 3040US2010059820A1Semiconductor device and method for manufacturing semiconductor deviceUNIV TOHOKU NAT UNIV CORP·Filed 2007·Application pending·0 cites
- 3139US2009000742A1Shower Plate and Method for Manufacturing the SameUNIV TOHOKU NAT UNIV CORP·Filed 2006·Application pending·0 cites
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