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UTAC THAI LTD
TH25 patents
Top patents by PatentIndex Score
US7327017B2Feb 5, 2008
Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound
UTAC THAI LTD40 citations94
US8460970B1Jun 11, 2013
Lead frame ball grid array with traces under die having interlocking features
UTAC THAI LTD7 citations84
US8461694B1Jun 11, 2013
Lead frame ball grid array with traces under die having interlocking features
UTAC THAI LTD7 citations84
US8013437B1Sep 6, 2011
Package with heat transfer
UTAC THAI LTD9 citations84
US7790512B1Sep 7, 2010
Molded leadframe substrate semiconductor package
UTAC THAI LTD14 citations84
US8367476B2Feb 5, 2013
Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
UTAC THAI LTD11 citations77
US8704381B2Apr 22, 2014
Very extremely thin semiconductor package
UTAC THAI LTD1 citations63
US7572168B1Aug 11, 2009
Method and apparatus for high speed singulation
UTAC THAI LTD6 citations54
US9972563B2May 15, 2018
Plated terminals with routing interconnections semiconductor device
UTAC THAI LTD0 citations52
US9922913B2Mar 20, 2018
Plated terminals with routing interconnections semiconductor device
UTAC THAI LTD0 citations52
US9922914B2Mar 20, 2018
Plated terminals with routing interconnections semiconductor device
UTAC THAI LTD0 citations52
US9818676B2Nov 14, 2017
Singulation method for semiconductor package with plating on side of connectors
UTAC THAI LTD0 citations52
US9449905B2Sep 20, 2016
Plated terminals with routing interconnections semiconductor device
UTAC THAI LTD0 citations52
US9093486B2Jul 28, 2015
Molded leadframe substrate semiconductor package
UTAC THAI LTD0 citations52
US8722461B2May 13, 2014
Leadframe based multi terminal IC package
UTAC THAI LTD0 citations52
US8368189B2Feb 5, 2013
Auxiliary leadframe member for stabilizing the bond wire process
UTAC THAI LTD1 citations52
US7656173B1Feb 2, 2010
Strip socket having a recessed portions in the base to accept bottom surface of packaged semiconductor devices mounted on a leadframe for testing and burn-in
UTAC THAI LTD2 citations52
US9029198B2May 12, 2015
Methods of manufacturing semiconductor devices including terminals with internal routing interconnections
UTAC THAI LTD0 citations51
US9000590B2Apr 7, 2015
Protruding terminals with internal routing interconnections semiconductor device
UTAC THAI LTD0 citations51
US8685794B2Apr 1, 2014
Lead frame land grid array with routing connector trace under unit
UTAC THAI LTD0 citations49
US8652879B2Feb 18, 2014
Lead frame ball grid array with traces under die
UTAC THAI LTD1 citations49
US7922877B2Apr 12, 2011
Method and apparatus for plating a semiconductor package
UTAC THAI LTD0 citations44
US7718522B2May 18, 2010
Method and apparatus for plating a semiconductor package
UTAC THAI LTD0 citations44
US9355940B1May 31, 2016
Auxiliary leadframe member for stabilizing the bond wire process
UTAC THAI LTD0 citations42
US10586771B2Mar 10, 2020
Conductive shield for semiconductor package
UTAC THAI LTD0 citations31