Assignee
WU JIUN YI
TW·3 granted patents·1 pending application·16 citations·filing 2012–2012
Top patents by PatentIndex Score
4 records- 0191US9691636B2Interposer frame and method of manufacturing the sameWU JIUN YI·Filed 2012·Granted Jun 27, 2017·9 cites·20 claims
- 0279US8946072B2No-flow underfill for package with interposer frameWU JIUN YI·Filed 2012·Granted Feb 3, 2015·4 cites·21 claims
- 0375US8766460B2Package with interposer frame and method of making the sameWU JIUN YI·Filed 2012·Granted Jul 1, 2014·3 cites·20 claims
- 0447US2013181359A1Methods and Apparatus for Thinner Package on Package StructuresWU JIUN YI·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →