Assignee
YIM CHOONG BIN
KR·4 granted patents·21 citations·filing 2011–2011
Top patents by PatentIndex Score
4 records- 0192US8187921B2Semiconductor package having ink-jet type dam and method of manufacturing the sameYIM CHOONG-BIN·Filed 2011·Granted May 29, 2012·14 cites·14 claims
- 0284US8759959B2Stacked semiconductor packagesYIM CHOONG-BIN·Filed 2011·Granted Jun 24, 2014·7 cites·10 claims
- 0348US8530280B2Integrated circuit package system with contoured encapsulation and method for manufacturing thereofYIM CHOONG BIN·Filed 2011·Granted Sep 10, 2013·0 cites·18 claims
- 0441US8952513B2Stack type semiconductor package and method of fabricating the sameYIM CHOONG-BIN·Filed 2011·Granted Feb 10, 2015·0 cites·20 claims
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