Stack type semiconductor package and method of fabricating the same

Abstract

A stack type semiconductor package and a method of fabricating the stack type semiconductor package. The stack type semiconductor package includes: a lower semiconductor package including a circuit board, a semiconductor chip which is disposed on an upper surface of the circuit board, via-pads which are arrayed on the upper surface of the circuit board around the semiconductor chip, and an encapsulation layer which encapsulates the upper surface of the circuit board and has via-holes through which the via-pads are exposed; and an upper semiconductor package which is stacked on the encapsulation layer, is electrically connected to the lower semiconductor package, and comprises internal connection terminals which are formed on a lower surface of the upper semiconductor package.

What is claimed is: 
     
       1. A stack type semiconductor package comprising:
 a lower semiconductor package comprising: a circuit board, a semiconductor chip which is disposed on an upper surface of the circuit board, via-pads which are arrayed on the upper surface of the circuit board around the semiconductor chip, and an encapsulation layer which encapsulates the upper surface of the circuit board and has via-holes through which the via-pads are exposed; and 
 an upper semiconductor package which is stacked on the encapsulation layer, is electrically connected to the lower semiconductor package, and comprises internal connection terminals which are formed on a lower surface of the upper semiconductor package. 
 wherein the stack type semiconductor package further comprises redistribution layers which are electrically connected to and contacting the via-pads through the via-holes and are electrically connected to and contacting the internal connection terminals, and 
 wherein the redistribution layers are formed to protrude inside the via-holes and contact sidewalls of the via-holes. 
 
     
     
       2. The stack type semiconductor package of  claim 1 , wherein the lower semiconductor package further comprises external connection terminals which are arrayed on a lower surface of the circuit board. 
     
     
       3. The stack type semiconductor package of  claim 1 , wherein the semiconductor chip is flip-chip mounted on the circuit board and is electrically connected to the circuit board through chip connection terminals, and a back surface of the semiconductor chip is not covered by the encapsulation layer. 
     
     
       4. The stack type semiconductor package of  claim 3 , wherein the redistribution layers extend onto the back surface of the semiconductor chip and the encapsulation layer. 
     
     
       5. The stack type semiconductor package of  claim 4 , wherein the redistribution layers comprise a lead frame. 
     
     
       6. The stack type semiconductor package of  claim 3 , wherein the semiconductor chip comprises chip-through electrodes which are electrically connected to the chip connection terminals. 
     
     
       7. The stack type semiconductor package of  claim 6 , wherein the circuit board comprises board-through electrodes which are electrically connected to the chip connection terminals. 
     
     
       8. The stack type semiconductor package of  claim 1 , wherein the lower semiconductor package further comprises conductive wires which electrically connect the semiconductor chip to the circuit board, and the semiconductor chip, the via-pads, and the conductive wires are encapsulated by the encapsulation layer. 
     
     
       9. The stack type semiconductor package of  claim 8 , wherein the redistribution layers disposed on the encapsulation layer. 
     
     
       10. A stack type semiconductor package comprising:
 a lower semiconductor package comprising:
 a circuit board, 
 a semiconductor chip mounted on an upper surface of the circuit board, 
 via pads which are arrayed on the upper surface of the circuit board around the semiconductor chip, 
 an encapsulation layer encapsulating the upper surface of the circuit board, the encapsulation layer comprising via holes through which the via pads are exposed, 
 redistribution layers formed on an upper surface of the encapsulating layer and an upper surface of the semiconductor chip and electrically connected to the via pads through the via holes; and 
 
 an upper semiconductor package stacked on the lower semiconductor package, the upper semiconductor package comprising:
 internal connection terminals disposed on a lower surface of the upper semiconductor package and electrically connected to the redistribution layers; 
 
 wherein a pitch between the internal connection terminals of the upper semiconductor package is smaller than a pitch between the via pads of the lower semiconductor package. 
 
     
     
       11. The stack type semiconductor package of  claim 10 , wherein the lower semiconductor package further comprises external connection terminals which are arrayed on a lower surface of the circuit board. 
     
     
       12. The stack type semiconductor package of  claim 11 , wherein the semiconductor chip is flip-chip mounted on the circuit board and is electrically connected to the circuit board through chip connection terminals, and a back surface of the semiconductor chip is not covered by the encapsulation layer. 
     
     
       13. The stack type semiconductor package of  claim 12 , wherein the redistribution layers extend onto the back surface of the semiconductor chip and the encapsulation layer, and are electrically connected to the internal connection terminals 
     
     
       14. The stack type semiconductor package of  claim 13 , wherein the redistribution layers comprise a lead frame. 
     
     
       15. The stack type semiconductor package of  claim 12 , wherein the semiconductor chip comprises chip-through electrodes which are electrically connected to the chip connection terminals. 
     
     
       16. The stack type semiconductor package of  claim 15 , wherein the circuit board comprises board-through electrodes which are electrically connected to the chip connection terminals. 
     
     
       17. The stack type semiconductor package of  claim 10 , wherein the lower semiconductor package further comprises conductive wires which electrically connect the semiconductor chip to the circuit board, and the semiconductor chip, the via-pads, and the conductive wires are encapsulated by the encapsulation layer. 
     
     
       18. A stack type semiconductor package comprising;
 a lower semiconductor package comprising:
 a circuit board which includes board-through electrodes, 
 a semiconductor chip which includes chip-through electrodes and is flip-chip mounted on an upper surface of the circuit board, wherein a back surface of the semiconductor chip is exposed to the outside, and the chip-through electrodes are electrically connected to the circuit board through the board-through electrodes, 
 via-pads which are arrayed on the upper surface of the circuit board around the semiconductor chip, and 
 an encapsulant layer which protects the semiconductor chip and has via holes therethrough which expose the via-pads; and 
 
 an upper semiconductor package stacked on the lower semiconductor package, the upper semiconductor package comprising;
 internal connection terminals formed on a lower surface of the upper semiconductor package and electrically connected to the lower semiconductor package. 
 
 
     
     
       19. The stack type semiconductor package of  claim 18 , wherein the internal connection terminals of the upper semiconductor package are electrically connected to the chip-through electrodes and the board-through electrodes. 
     
     
       20. The stack type semiconductor package of  claim 18 , further comprising redistribution layers which are connected to the via-pads through the via-holes and are electrically connected to the internal connection terminals on the back surface of the semiconductor chip and the encapsulation layer, wherein the redistribution layers are electrically connected to the chip-through electrodes and the board-through electrodes.