Inventor · disambiguated record
Choong Bin Yim
Also filed as: YIM CHOONG-BIN
20 granted patents·4 pending applications·306 citations·filing 1998–2023
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
24 records- 0198US7288835B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 30, 2007·135 cites·17 claims
- 0296US7312519B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 25, 2007·50 cites·5 claims
- 0392US8187921B2Semiconductor package having ink-jet type dam and method of manufacturing the sameYIM CHOONG-BIN·Filed 2011·Granted May 29, 2012·14 cites·14 claims
- 0492US7298037B2Stacked integrated circuit package-in-package system with recessed spacerSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·27 cites·15 claims
- 0590US7482203B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jan 27, 2009·18 cites·20 claims
- 0689US7501697B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 10, 2009·16 cites·9 claims
- 0787US7999368B2Semiconductor package having ink-jet type dam and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 16, 2011·12 cites·10 claims
- 0884US8759959B2Stacked semiconductor packagesYIM CHOONG-BIN·Filed 2011·Granted Jun 24, 2014·7 cites·10 claims
- 0976US9190401B2Stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2015·3 cites·19 claims
- 1076US7755180B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jul 13, 2010·5 cites·17 claims
- 1175US7884460B2Integrated circuit packaging system with carrier and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Feb 8, 2011·5 cites·8 claims
- 1268US7446396B2Stacked integrated circuit leadframe package systemSTATS CHIPPAC LTD·Filed 2006·Granted Nov 4, 2008·3 cites·10 claims
- 1363US7985623B2Integrated circuit package system with contoured encapsulationSTATS CHIPPAC LTD·Filed 2007·Granted Jul 26, 2011·2 cites·18 claims
- 1460US7679169B2Stacked integrated circuit leadframe package systemSTATS CHIPPAC LTD·Filed 2008·Granted Mar 16, 2010·1 cites·10 claims
- 1559US9245863B2Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heightsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 26, 2016·1 cites·13 claims
- 1659US2024105567A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1757US2024055398A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1856US2024128173A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1950US8049322B2Integrated circuit package-in-package system and method for making thereofSTATS CHIPPAC LTD·Filed 2010·Granted Nov 1, 2011·0 cites·14 claims
- 2048US8530280B2Integrated circuit package system with contoured encapsulation and method for manufacturing thereofYIM CHOONG BIN·Filed 2011·Granted Sep 10, 2013·0 cites·18 claims
- 2146US2009065949A1Semiconductor package and semiconductor module having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2243US8367465B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2006·Granted Feb 5, 2013·0 cites·20 claims
- 2341US8952513B2Stack type semiconductor package and method of fabricating the sameYIM CHOONG-BIN·Filed 2011·Granted Feb 10, 2015·0 cites·20 claims
- 2438US6124152AMethod for fabricating cob type semiconductor packageLG SEMICON CO LTD·Filed 1998·Granted Sep 26, 2000·7 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →