Assignee
ZEN VOCE CORP
TW·1 granted patent·2 pending applications·0 citations·filing 2007–2015
Top patents by PatentIndex Score
3 records- 0137US8955735B2Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuitZEN VOCE CORP·Filed 2013·Granted Feb 17, 2015·0 cites·7 claims
- 0233US2015228613A1Apparatus and Method for Placing and Mounting Solder Balls on an Integrated Circuit SubstrateZEN VOCE CORP·Filed 2015·Application pending·0 cites
- 0328US2009079462A1Semiconductor device testing apparatusZEN VOCE CORP·Filed 2007·Application pending·0 cites
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