Assignee
ABSOLICS INC
US·14 granted patents·44 pending applications·5 citations·filing 2020–2025
Top patents by PatentIndex Score
58 records- 0193US11437308B2Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatusABSOLICS INC·Filed 2021·Granted Sep 6, 2022·3 cites·14 claims
- 0286US12456653B2Packaging substrate and semiconductor device comprising the sameABSOLICS INC·Filed 2022·Granted Oct 28, 2025·1 cites·8 claims
- 0378US12027454B1Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2023·Granted Jul 2, 2024·0 cites·10 claims
- 0477US12198994B2Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2020·Granted Jan 14, 2025·1 cites·9 claims
- 0575US11728259B2Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2022·Granted Aug 15, 2023·0 cites·10 claims
- 0674US2025096055A1Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 0771US11469167B2Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2021·Granted Oct 11, 2022·0 cites·10 claims
- 0870US12288742B2Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2023·Granted Apr 29, 2025·0 cites·5 claims
- 0967US12456672B2Packaging substrate having element group in cavity unit and semiconductor device comprising the sameABSOLICS INC·Filed 2023·Granted Oct 28, 2025·0 cites·12 claims
- 1066US2026096457A1Packaging substrate having embedded bridge and manufacturing method of the sameABSOLICS INC·Filed 2025·Application pending·0 cites
- 1165US2025210422A1Packaging substrate and manufacturing method thereofABSOLICS INC·Filed 2024·Application pending·0 cites
- 1265US2025079289A1Substrate and manufacturing method for the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 1365US2025218796A1Method of manufacturing substrate including packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 1465US2026001183A1Substrate loading cassetteABSOLICS INC·Filed 2025·Application pending·0 cites
- 1565US2026096446A1Manufacture method for a packaging substrateABSOLICS INC·Filed 2025·Application pending·0 cites
- 1664US2025174537A1Packaging substrate and semiconductor package comprising the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 1764US2025105072A1Packaging substrate and manufacturing method of the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 1864US2025183181A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 1964US2025102749A1Manufacturing method of packaging substrate and packaging substrate using the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 2064US2025218797A1Manufacturing method for packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 2164US2025105073A1Packaging substrate and manufacturing method of the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 2263US2025149393A1Substrate having sidewall protection layer and manufacturing method thereofABSOLICS INC·Filed 2024·Application pending·0 cites
- 2363US2026076239A1Packaging substrate and manufacturing method thereofABSOLICS INC·Filed 2025·Application pending·0 cites
- 2461US12469736B2Substrate carrier and substrate assembly comprising the sameABSOLICS INC·Filed 2022·Granted Nov 11, 2025·0 cites·10 claims
- 2561US2025079190A1Substrate and manufacturing method for the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 2661US2025183055A1Manufacturing method for a packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 2761US2026053031A1Packaging substrate and method of manufacturing the sameABSOLICS INC·Filed 2025·Application pending·0 cites
- 2861US2026026361A1Manufacturing method for packaging substrateABSOLICS INC·Filed 2025·Application pending·0 cites
- 2961US2024387342A1Substrate with embedded elements and manufacturing method of the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 3060US2024170361A1Packaging substrate and semiconductor package including the sameABSOLICS INC·Filed 2023·Application pending·0 cites
- 3160US2024186232A1Semiconductor packaging substrate, semiconductor packages, and method for manufacturing the semiconductor packaging substrateABSOLICS INC·Filed 2023·Application pending·0 cites
- 3259US12506040B2Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation methodABSOLICS INC·Filed 2022·Granted Dec 23, 2025·0 cites·10 claims
- 3359US2025079243A1Packaging substrate and method of manufacturing the sameABSOLICS INC·Filed 2023·Application pending·0 cites
- 3459US2025112098A1Packaging substrate, method of manufacturing an element package and method of manufacturing packaging substrateABSOLICS INC·Filed 2023·Application pending·0 cites
- 3558US2024055341A1Core-substrate, substrate and use of substrate for semiconductor packagingABSOLICS INC·Filed 2023·Application pending·0 cites
- 3658US2025079324A1Method of manufacturing packaging substrate and packaging substrate manufactured therebyABSOLICS INC·Filed 2023·Application pending·0 cites
- 3758US2026005085A1Packaging substrate and semiconductor package comprising sameABSOLICS INC·Filed 2025·Application pending·0 cites
- 3857US11652039B2Packaging substrate with core layer and cavity structure and semiconductor device comprising the sameABSOLICS INC·Filed 2020·Granted May 16, 2023·0 cites·9 claims
- 3957US2024162167A1Substrate and semiconductor moduleABSOLICS INC·Filed 2023·Application pending·0 cites
- 4057US2025149468A1Packaging substrate and semiconductor package comprising the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 4156US2024170379A1Packaging substrate and semiconductor package comprising the sameABSOLICS INC·Filed 2023·Application pending·0 cites
- 4256US2022165650A1Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2020·Application pending·0 cites
- 4355US2023411172A1Cleaned packaging substrate and cleaned packaging substrate manufacturing methodABSOLICS INC·Filed 2022·Application pending·0 cites
- 4454US2023028070A1Substrate comprising a lid structure, package substrate comprising the same and semiconductor deviceABSOLICS INC·Filed 2022·Application pending·0 cites
- 4554US2025149400A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 4654US2024021507A1Via connection structure comprising multiple vias and substrate comprising the sameABSOLICS INC·Filed 2022·Application pending·0 cites
- 4754US2024021508A1Device packaging substrate, manufacturing method for the same, and device package comprising the sameABSOLICS INC·Filed 2022·Application pending·0 cites
- 4854US2025140669A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 4954US2025140707A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 5053US2024399595A1Substrate gripper and method for moving a substrate using the sameABSOLICS INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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