Assignee
ACCRETECH USA INC
US·6 granted patents·7 pending applications·214 citations·filing 1999–2008
Top patents by PatentIndex Score
13 records- 0193US7508504B2Automatic wafer edge inspection and review systemACCRETECH USA INC·Filed 2007·Granted Mar 24, 2009·44 cites·25 claims
- 0293US6629875B2Machine for grinding-polishing of a water edgeACCRETECH USA INC·Filed 2000·Granted Oct 7, 2003·63 cites·33 claims
- 0390US6936546B2Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substratesACCRETECH USA INC·Filed 2003·Granted Aug 30, 2005·47 cites·14 claims
- 0490US6641464B1Method and apparatus for polishing the edge of a bonded waferACCRETECH USA INC·Filed 2003·Granted Nov 4, 2003·45 cites·16 claims
- 0547US2009122304A1Apparatus and Method for Wafer Edge Exclusion MeasurementACCRETECH USA INC·Filed 2008·Application pending·0 cites
- 0647US2009116727A1Apparatus and Method for Wafer Edge Defects DetectionACCRETECH USA INC·Filed 2008·Application pending·0 cites
- 0744US2008011421A1Processing chamber having labyrinth sealACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 0844US2008017316A1Clean ignition system for wafer substrate processingACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 0944US2008190558A1Wafer processing apparatus and methodACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 1044US2008010845A1Apparatus for cleaning a wafer substrateACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 1144US2008011332A1Method and apparatus for cleaning a wafer substrateACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 1243US6473987B1Method for measuring wafer thicknessACCRETECH USA INC·Filed 1999·Granted Nov 5, 2002·12 cites·19 claims
- 1340US6875076B2Polishing machine and methodACCRETECH USA INC·Filed 2002·Granted Apr 5, 2005·3 cites·24 claims
Join the waitlist — get patent alerts
Get an alert when ACCRETECH USA INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →