Assignee
ACM RES INC
US·12 granted patents·9 pending applications·1,531 citations·filing 1999–2006
Top patents by PatentIndex Score
21 records- 0198US6440295B1Method for electropolishing metal on semiconductor devicesACM RES INC·Filed 2000·Granted Aug 27, 2002·233 cites·168 claims
- 0298US6395152B1Methods and apparatus for electropolishing metal interconnections on semiconductor devicesACM RES INC·Filed 1999·Granted May 28, 2002·321 cites·48 claims
- 0398US6391166B1Plating apparatus and methodACM RES INC·Filed 1999·Granted May 21, 2002·434 cites·109 claims
- 0497US6248222B1Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 1999·Granted Jun 19, 2001·185 cites·62 claims
- 0595US6447668B1Methods and apparatus for end-point detectionACM RES INC·Filed 2000·Granted Sep 10, 2002·124 cites·36 claims
- 0692US6726823B1Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 1999·Granted Apr 27, 2004·124 cites·150 claims
- 0792US6495007B2Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplacesACM RES INC·Filed 2001·Granted Dec 17, 2002·25 cites·20 claims
- 0886US6638863B2Electropolishing metal layers on wafers having trenches or vias with dummy structuresACM RES INC·Filed 2002·Granted Oct 28, 2003·50 cites·82 claims
- 0985US6837984B2Methods and apparatus for electropolishing metal interconnections on semiconductor devicesACM RES INC·Filed 2002·Granted Jan 4, 2005·15 cites·35 claims
- 1076US6749728B2Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 2002·Granted Jun 15, 2004·7 cites·20 claims
- 1165US7136173B2Method and apparatus for end-point detectionACM RES INC·Filed 2001·Granted Nov 14, 2006·8 cites·20 claims
- 1255US7119008B2Integrating metal layers with ultra low-K dielectricsACM RES INC·Filed 2001·Granted Oct 10, 2006·5 cites·28 claims
- 1354US2004211664A1Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 2004·Application pending·0 cites
- 1450US2007052977A1Method and apparatus for end-point detectionACM RES INC·Filed 2006·Application pending·0 cites
- 1544US2004256245A1Methods and apparatus for electropolishing metal interconnections on semiconductor devicesACM RES INC·Filed 2004·Application pending·0 cites
- 1643US2007023912A1Integrating metal with ultra low-k-dielectricsACM RES INC·Filed 2006·Application pending·0 cites
- 1737US2007125661A1Controlling removal rate uniformity of an electropolishing process in integrated circuit fabricationACM RES INC·Filed 2005·Application pending·0 cites
- 1837US2007131561A1Controlling removal rate uniformity of an electropolishing process in integrated circuit fabricationACM RES INC·Filed 2004·Application pending·0 cites
- 1935US2005218003A1Electropolishing and/or electroplating apparatus and methodsACM RES INC·Filed 2003·Application pending·0 cites
- 2034US2006049056A1Electropolishing and electroplating methodsACM RES INC·Filed 2003·Application pending·0 cites
- 2133US2005245086A1Adaptive electropolishing using thickness measurement and removal of barrier and sacrificial layersACM RES INC·Filed 2003·Application pending·0 cites
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