Electropolishing and/or electroplating apparatus and methods

Abstract

In one aspect of the present invention, exemplary apparatus and methods are provided for electropolishing and/or electroplating processes for semiconductor wafers. One exemplary apparatus includes a cleaning module having an edge clean assembly ( 930 ) to remove metal residue on the bevel or edge portion of a wafer ( 901 ). The edge cleaning apparatus includes a nozzle head ( 1030 ) configured to supply a liquid and a gas to a major surface of the wafer, and supplies the gas radially inward of the location the liquid is supplied to reduce the potential of the liquid from flowing radially inward to the metal film formed on the wafer.

1 . An apparatus for processing one or more semiconductor wafers, comprising: 
 a module for storing a wafer;    a plurality of vertically stacked processing modules for at least one of electropolishing the wafer and electroplating the wafer;    a cleaning module; and    a robot for transferring the wafer between the module for storing, the processing module, and the cleaning module,    wherein the apparatus is divided into at least two sections characterized by separate frames.    
   
   
       2 . The apparatus of  claim 1 , further including a pre-alignment module to align the wafer prior to processing.  
   
   
       3 . The apparatus of  claim 1 , wherein the robot includes one or more end effectors for picking and transferring the wafer.  
   
   
       4 . The apparatus of  claim 1 , wherein the robot is removable by rolling or sliding out from one of the at least two sections.  
   
   
       5 . The apparatus of  claim 1 , wherein the robot includes, 
 a first end effector for transferring the wafer to the processing modules, and    a second end effector for transferring the wafer from the processing modules.    
   
   
       6 . The apparatus of  claim 1 , further including a liquid delivery system for delivering process liquid to the processing modules.  
   
   
       7 . The apparatus of  claim 6 , wherein the liquid delivery system includes a surge suppressor.  
   
   
       8 . The apparatus of  claim 6 , wherein the liquid delivery system includes a controller to modulate a flow rate of the process liquid.  
   
   
       9 . The apparatus of  claim 6 , wherein the liquid delivery system is housed in a containment tray.  
   
   
       10 . The apparatus of  claim 6  wherein the apparatus includes an exhaust to remove gases from the processing modules.  
   
   
       11 . A method for at least one of electropolishing and electroplating a semiconductor wafer in a process assembly, comprising: 
 transferring a wafer to one of a plurality of stacked processing modules with a first end effector;    electropolishing or electroplating the wafer in the processing module;    transferring the wafer from the processing module to a cleaning module with a second end effector; and    cleaning the wafer in the cleaning module, wherein the process assembly is divided into at least two sections characterized by separate frames.    
   
   
       12 . The method of  claim 11 , further wherein transferring the wafer includes using a robot and wherein the robot is configured to slide or roll out of the process assembly.  
   
   
       13 . The method of  claim 11 , further including delivering liquid to the processing module through a supply line, wherein a surge suppressor is associated with the supply line.  
   
   
       14 . The method of  claim 11 , further including removing gases from the processing module through an exhaust system.  
   
   
       15 - 137 . (canceled)