Inventor · disambiguated record
Voha Nuch
Also filed as: NUCH VOHA
7 granted patents·6 pending applications·131 citations·filing 1999–2020
80Inventor score
Top patents by PatentIndex Score
13 records- 0192US6726823B1Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 1999·Granted Apr 27, 2004·124 cites·150 claims
- 0282US8518224B2Plating apparatus for metallization on semiconductor workpieceMA YUE·Filed 2007·Granted Aug 27, 2013·4 cites·33 claims
- 0365US8671961B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2013·Granted Mar 18, 2014·1 cites·9 claims
- 0461US8580042B2Methods and apparatus for cleaning semiconductor wafersNUCH VOHA·Filed 2007·Granted Nov 12, 2013·2 cites·24 claims
- 0560US12111575B2Coater with automatic cleaning function and coater automatic cleaning methodACM RESEARCH SHANGHAI INC·Filed 2020·Granted Oct 8, 2024·0 cites·14 claims
- 0655US10816901B2Coater with automatic cleaning function and coater automatic cleaning methodACM RESEARCH SHANGHAI INC·Filed 2014·Granted Oct 27, 2020·0 cites·11 claims
- 0745US8383429B2Method and apparatus for thermal treatment of semiconductor workpiecesACM RESEARCH SHANGHAI INC·Filed 2007·Granted Feb 26, 2013·0 cites·50 claims
- 0845US2011079247A1Solution preparation apparatus and method for treating individual semiconductor workpieceMA YUE·Filed 2008·Application pending·0 cites
- 0943US2011073469A1Electrochemical deposition systemMA YUE·Filed 2008·Application pending·0 cites
- 1036US2007039827A1Measuring alignment between a wafer chuck and polishing/plating receptacleACM REASEARCH INC·Filed 2003·Application pending·0 cites
- 1135US2005218003A1Electropolishing and/or electroplating apparatus and methodsACM RES INC·Filed 2003·Application pending·0 cites
- 1234US2004104120A1Method and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesFiled 2003·Application pending·0 cites
- 1331US2004238481A1Electropolishing assembly and methods for electropolishing conductive layersFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →