Inventor · disambiguated record
Hui Wang
Also filed as: WANG HUI · WANG HUI-HENG
86 granted patents·56 pending applications·1,637 citations·filing 1999–2025
99Inventor score
Top patents by PatentIndex Score
142 records- 0198US6440295B1Method for electropolishing metal on semiconductor devicesACM RES INC·Filed 2000·Granted Aug 27, 2002·233 cites·168 claims
- 0298US6395152B1Methods and apparatus for electropolishing metal interconnections on semiconductor devicesACM RES INC·Filed 1999·Granted May 28, 2002·321 cites·48 claims
- 0398US6391166B1Plating apparatus and methodACM RES INC·Filed 1999·Granted May 21, 2002·434 cites·109 claims
- 0497US6248222B1Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 1999·Granted Jun 19, 2001·185 cites·62 claims
- 0595US6447668B1Methods and apparatus for end-point detectionACM RES INC·Filed 2000·Granted Sep 10, 2002·124 cites·36 claims
- 0692US6726823B1Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 1999·Granted Apr 27, 2004·124 cites·150 claims
- 0792US6495007B2Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplacesACM RES INC·Filed 2001·Granted Dec 17, 2002·25 cites·20 claims
- 0891US7335924B2High-brightness light emitting diode having reflective layerVISUAL PHOTONICS EPITAXY CO LT·Filed 2005·Granted Feb 26, 2008·28 cites·20 claims
- 0990US11581205B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Feb 14, 2023·2 cites·42 claims
- 1089US9558985B2Vacuum chuckWANG JIAN·Filed 2012·Granted Jan 31, 2017·11 cites·19 claims
- 1189US7384808B2Fabrication method of high-brightness light emitting diode having reflective layerVISUAL PHOTONICS EPITAXY CO LT·Filed 2005·Granted Jun 10, 2008·22 cites·24 claims
- 1286US11141762B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 12, 2021·3 cites·42 claims
- 1386US6638863B2Electropolishing metal layers on wafers having trenches or vias with dummy structuresACM RES INC·Filed 2002·Granted Oct 28, 2003·50 cites·82 claims
- 1485US6837984B2Methods and apparatus for electropolishing metal interconnections on semiconductor devicesACM RES INC·Filed 2002·Granted Jan 4, 2005·15 cites·35 claims
- 1583US8598039B2Barrier layer removal method and apparatusWANG JIAN·Filed 2008·Granted Dec 3, 2013·8 cites·12 claims
- 1682US10297472B2Method and apparatus for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2012·Granted May 21, 2019·5 cites·29 claims
- 1781US11911808B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2023·Granted Feb 27, 2024·0 cites·40 claims
- 1879US9496172B2Method for forming interconnection structuresACM RESEARCH SHANGHAI INC·Filed 2012·Granted Nov 15, 2016·4 cites·14 claims
- 1978US11629425B2Method and apparatus for uniformly metallization on substrateACM RESEARCH SHANGHAI INC·Filed 2021·Granted Apr 18, 2023·0 cites·19 claims
- 2078US11037804B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2016·Granted Jun 15, 2021·2 cites·33 claims
- 2177US12186684B2Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic deviceACM RESEARCH SHANGHAI INC·Filed 2024·Granted Jan 7, 2025·0 cites·13 claims
- 2277US11257667B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Feb 22, 2022·2 cites·27 claims
- 2376US12467156B2Plating apparatus and plating methodACM RESEARCH SHANGHAI INC·Filed 2023·Granted Nov 11, 2025·0 cites·10 claims
- 2476US10907266B2Method and apparatus for uniformly metallization on substrateACM RESEARCH SHANGHAI INC·Filed 2018·Granted Feb 2, 2021·0 cites·14 claims
- 2576US6749728B2Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesACM RES INC·Filed 2002·Granted Jun 15, 2004·7 cites·20 claims
- 2675US11633765B2System for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2021·Granted Apr 25, 2023·0 cites·14 claims
- 2774US10910244B2Methods and system for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2015·Granted Feb 2, 2021·2 cites·35 claims
- 2873US12494360B2Apparatus and method for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2024·Granted Dec 9, 2025·0 cites·19 claims
- 2973US10811307B2Polishing slurries for polishing semiconductor wafersGLOBAL WAFERS CO LTD·Filed 2018·Granted Oct 20, 2020·1 cites·18 claims
- 3072US2024183051A1Electroplating apparatus and electroplating methodACM RESEARCH SHANGHAI INC·Filed 2024·Application pending·0 cites
- 3172US2025285882A1Method and apparatus for removing particles or photoresist on substratesACM RESEARCH SHANGHAI INC·Filed 2025·Application pending·0 cites
- 3271US9666426B2Methods and apparatus for uniformly metallization on substratesWANG HUI·Filed 2011·Granted May 30, 2017·2 cites·16 claims
- 3370US12337069B1Detoxifying light emitting device and use thereofU S ARMY COMBAT CAPABILITIES DEV COMMAND CHEMICAL BIOLOGICAL CENTER·Filed 2022·Granted Jun 24, 2025·0 cites·14 claims
- 3470US11967497B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 3570US11469134B2Plating chuckACM RESEARCH SHANGHAI INC·Filed 2017·Granted Oct 11, 2022·1 cites·20 claims
- 3670US11043395B2Methods for processing semiconductor wafers having a polycrystalline finishSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2016·Granted Jun 22, 2021·1 cites·12 claims
- 3769US10410906B2Substrate supporting apparatusACM RESEARCH SHANGHAI INC·Filed 2012·Granted Sep 10, 2019·3 cites·13 claims
- 3869US10128146B2Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structuresSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2016·Granted Nov 13, 2018·1 cites·13 claims
- 3968US11367649B2Semiconductor substrate polishing methodsGLOBALWAFERS CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·12 claims
- 4068US10141205B2Apparatus and method for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2014·Granted Nov 27, 2018·2 cites·10 claims
- 4168US10113244B2Method and apparatus for uniformly metallization on substrateACM RESEARCH SHANGHAI INC·Filed 2013·Granted Oct 30, 2018·0 cites·23 claims
- 4267US11955328B2Method and apparatus for cleaning semiconductor waferACM RESEARCH SHANGHAI INC·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 4367US9633833B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Apr 25, 2017·1 cites·14 claims
- 4466US11925881B2Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic deviceACM RESEARCH SHANGHAI INC·Filed 2021·Granted Mar 12, 2024·0 cites·11 claims
- 4565US12308247B2Methods for processing semiconductor wafers having a polycrystalline finishGLOBALWAFERS CO LTD·Filed 2021·Granted May 20, 2025·0 cites·5 claims
- 4665US7136173B2Method and apparatus for end-point detectionACM RES INC·Filed 2001·Granted Nov 14, 2006·8 cites·20 claims
- 4764US11848217B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted Dec 19, 2023·0 cites·37 claims
- 4864US11638937B2Methods and apparatus for cleaning substratesACM RESEARCH SHANGHAI INC·Filed 2021·Granted May 2, 2023·0 cites·52 claims
- 4964US9595457B2Methods and apparatus for cleaning semiconductor wafersWANG JIAN·Filed 2008·Granted Mar 14, 2017·2 cites·12 claims
- 5063US9070723B2Methods and apparatus for cleaning semiconductor wafersWANG HUI·Filed 2007·Granted Jun 30, 2015·1 cites·36 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →