Assignee
ADEIA SEMICONDUCTOR TECH LLC
US·42 granted patents·31 pending applications·50 citations·filing 2016–2025
Top patents by PatentIndex Score
73 records- 0198US11935907B2Image sensor deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Mar 19, 2024·5 cites·30 claims
- 0298US11908739B2Flat metal features for microelectronics applicationsADEIA SEMICONDUCTOR TECH LLC·Filed 2020·Granted Feb 20, 2024·5 cites·15 claims
- 0398US11876076B2Apparatus for non-volatile random access memory stacksADEIA SEMICONDUCTOR TECH LLC·Filed 2020·Granted Jan 16, 2024·7 cites·31 claims
- 0498US11715730B2Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elementsADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Aug 1, 2023·6 cites·19 claims
- 0598US11710718B2Structures and methods for low temperature bonding using nanoparticlesADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Jul 25, 2023·10 cites·22 claims
- 0697US12027487B2Structures for low temperature bonding using nanoparticlesADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Jul 2, 2024·3 cites·17 claims
- 0797US11824046B2Symbiotic network on layersADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Nov 21, 2023·2 cites·16 claims
- 0897US2026041011A1Direct-bonded optoelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 0996US11973056B2Methods for low temperature bonding using nanoparticlesADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Apr 30, 2024·2 cites·19 claims
- 1095US2026083016A1Embedded organic interposer for high bandwidthADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 1193US11621246B2Diffused bitline replacement in stacked wafer memoryADEIA SEMICONDUCTOR TECH LLC·Filed 2020·Granted Apr 4, 2023·2 cites·20 claims
- 1292US2025118705A1Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1391US12191267B2Nanowire bonding interconnect for fine-pitch microelectronicsADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 1491US2025105234A1Direct-bonded led arrays and driver circuitsADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1590US2025038161A1Direct-bonded optoelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1689US11862602B2Scalable architecture for reduced cycles across SOCADEIA SEMICONDUCTOR TECH LLC·Filed 2019·Granted Jan 2, 2024·4 cites·18 claims
- 1788US12557659B2Wire bonding method and apparatus for electromagnetic interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 1888US12199082B2Method of direct-bonded optoelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 14, 2025·0 cites·21 claims
- 1988US12170268B2Embedded metal linesADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Dec 17, 2024·0 cites·28 claims
- 2088US11929347B2Mixed exposure for large dieADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Mar 12, 2024·1 cites·28 claims
- 2187US2025038152A1Embedded metal linesADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 2286US12255153B2Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Mar 18, 2025·0 cites·25 claims
- 2386US12166024B2Direct-bonded LED arrays driversADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Dec 10, 2024·0 cites·19 claims
- 2486US2025349741A1Region shielding within a package of a microelectronic deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 2586US2024347404A1Fine pitch bva using reconstituted wafer with area array accessible for testingADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 2685US12476212B23D-interconnectADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Nov 18, 2025·0 cites·12 claims
- 2785US12283572B2Symbiotic network on layersADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Apr 22, 2025·0 cites·18 claims
- 2885US12211821B2Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 2984US12564086B2Structures for low temperature bonding using nanoparticlesADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Feb 24, 2026·0 cites·27 claims
- 3084US12381117B2Through-dielectric-vias (TDVs) for 3D integrated circuits in siliconADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 3184US12324268B2Image sensor deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Jun 3, 2025·0 cites·29 claims
- 3284US12094835B2Wire bonding method and apparatus for electromagnetic interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Sep 17, 2024·0 cites·15 claims
- 3383US2026082717A1Image sensor deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 3482US11978724B2Diffused bitline replacement in memoryADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted May 7, 2024·0 cites·28 claims
- 3582US2025253264A1Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 3682US2024006377A1Multi-chip modules formed using wafer-level processing of a reconstituted waferADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Application pending·0 cites
- 3782US2026041003A1Symbiotic Network On LayersADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 3881US12394728B2Method of forming a region shielding within a package of a microelectronic deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Aug 19, 2025·0 cites·12 claims
- 3981US12288771B2Apparatus for non-volatile random access memory stacksADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 4081US12272673B2Capacitive coupling in a direct-bonded interface for microelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Apr 8, 2025·0 cites·19 claims
- 4181US12237306B2Correction die for wafer/die stackADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Feb 25, 2025·0 cites·21 claims
- 4281US2025022752A1Flat metal features for microelectronics applicationsADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 4381US2025096168A1Nanowire bonding interconnect for fine-pitch microelectronicsADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 4481US2025033138A1Advanced Device Assembly Structures And MethodsADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 4580US11990382B2Fine pitch BVA using reconstituted wafer with area array accessible for testingADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted May 21, 2024·0 cites·22 claims
- 4680US2026018564A1Capacitive coupling in a direct-bonded interface for microelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 4780US2024429100A1THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICONADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 4879US12255176B2Scalable architecture for reduced cycles across SOCADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Mar 18, 2025·0 cites·10 claims
- 4978US12087629B2Through-dielectric-vias (TDVs) for 3D integrated circuits in siliconADEIA SEMICONDUCTOR TECH LLC·Filed 2016·Granted Sep 10, 2024·2 cites·22 claims
- 5078US11837556B2Wire bonding method and apparatus for electromagnetic interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Dec 5, 2023·0 cites·17 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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