Assignee
ADVANCED MICRO FAB EQUIP INC
KY·9 granted patents·6 pending applications·174 citations·filing 2006–2020
Top patents by PatentIndex Score
15 records- 0195US7503996B2Multiple frequency plasma chamber, switchable RF system, and processes using sameADVANCED MICRO FAB EQUIP INC·Filed 2007·Granted Mar 17, 2009·33 cites·21 claims
- 0294US7658800B2Gas distribution assembly for use in a semiconductor work piece processing reactorADVANCED MICRO FAB EQUIP INC·Filed 2006·Granted Feb 9, 2010·28 cites·21 claims
- 0393US7868556B2RF matching network of a vacuum processing chamber and corresponding configuration methodsADVANCED MICRO FAB EQUIP INC·Filed 2006·Granted Jan 11, 2011·59 cites·27 claims
- 0486US8366829B2Multi-station decoupled reactive ion etch chamberADVANCED MICRO FAB EQUIP INC·Filed 2007·Granted Feb 5, 2013·10 cites·17 claims
- 0586US7516833B2Multi-station workpiece processors, methods of processing semiconductor workpieces within multi-station workpiece processors, and methods of moving semiconductor workpieces within multi-station workpiece processorsADVANCED MICRO FAB EQUIP INC·Filed 2006·Granted Apr 14, 2009·23 cites·29 claims
- 0685US7992518B2Silicon carbide gas distribution plate and RF electrode for plasma etch chamberADVANCED MICRO FAB EQUIP INC·Filed 2007·Granted Aug 9, 2011·10 cites·11 claims
- 0783US9275870B2Plasma processing method and plasma processing deviceADVANCED MICRO FAB EQUIP INC·Filed 2013·Granted Mar 1, 2016·7 cites·20 claims
- 0868US7935186B2Plasma processing apparatusADVANCED MICRO FAB EQUIP INC·Filed 2006·Granted May 3, 2011·2 cites·10 claims
- 0967US7682483B2Vacuum processing chamber and method of processing a semiconductor work pieceADVANCED MICRO FAB EQUIP INC·Filed 2006·Granted Mar 23, 2010·2 cites·13 claims
- 1050US2013048216A1Capacitive cvd reactor and methods for plasma cvd processADVANCED MICRO FAB EQUIP INC·Filed 2012·Application pending·0 cites
- 1149US2007166459A1Assembly and method for delivering a reactant material onto a substrateADVANCED MICRO FAB EQUIP INC·Filed 2006·Application pending·0 cites
- 1247US2007032097A1Method and apparatus for processing semiconductor work piecesADVANCED MICRO FAB EQUIP INC·Filed 2006·Application pending·0 cites
- 1347US2010271745A1Electrostatic chuck and base for plasma reactor having improved wafer etch rateADVANCED MICRO FAB EQUIP INC·Filed 2009·Application pending·0 cites
- 1445US2025179640A1Heating apparatus, cvd equipment including the heating apparatusADVANCED MICRO FAB EQUIP INC·Filed 2020·Application pending·0 cites
- 1538US2011030900A1Plasma chamber having switchable bias power and a switchable frequency rf match network thereforADVANCED MICRO FAB EQUIP INC·Filed 2010·Application pending·0 cites
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