Assignee
ADVANCED SEMICONDUCTOR ENG
TW·1,733 granted patents·582 pending applications·17,440 citations·filing 1995–2025
Top patents by PatentIndex Score
2,315 records- 0198US9831195B1Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Nov 28, 2017·34 cites·20 claims
- 0298US8012797B2Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometriesADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 6, 2011·146 cites·20 claims
- 0398US7989928B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Aug 2, 2011·113 cites·18 claims
- 0498US7550836B2Structure of package on package and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 23, 2009·130 cites·18 claims
- 0598US6452270B1Semiconductor device having bump electrodeADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Sep 17, 2002·196 cites·9 claims
- 0698US6238952B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted May 29, 2001·258 cites·8 claims
- 0797US11908815B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 0897US11776885B2Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 3, 2023·4 cites·16 claims
- 0997US11721652B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 8, 2023·3 cites·14 claims
- 1097US11682656B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 20, 2023·4 cites·18 claims
- 1197US11276661B2Package structure including two joint structures including different materials and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 15, 2022·14 cites·20 claims
- 1297US10304765B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 28, 2019·37 cites·20 claims
- 1397US10276382B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 30, 2019·27 cites·46 claims
- 1497US9887167B1Embedded component package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 6, 2018·54 cites·21 claims
- 1597US9837352B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Dec 5, 2017·41 cites·22 claims
- 1697US9549468B1Semiconductor substrate, semiconductor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jan 17, 2017·36 cites·20 claims
- 1797US8372689B2Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 12, 2013·42 cites·20 claims
- 1897US8022511B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Sep 20, 2011·81 cites·21 claims
- 1997US7829961B2MEMS microphone package and method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 9, 2010·117 cites·10 claims
- 2097US7321168B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 22, 2008·55 cites·16 claims
- 2197US7005750B2Substrate with reinforced contact pad structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Feb 28, 2006·155 cites·12 claims
- 2297US6355502B1Semiconductor package and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 12, 2002·270 cites·20 claims
- 2397US6342730B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jan 29, 2002·148 cites·8 claims
- 2496US10388598B2Interposer, semiconductor package structure, and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 20, 2019·10 cites·19 claims
- 2596US7700411B2Semiconductor device package and manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Apr 20, 2010·88 cites·10 claims
- 2696US7642133B2Method of making a semiconductor package and method of making a semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 5, 2010·183 cites·25 claims
- 2796US7633170B2Semiconductor device package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 15, 2009·71 cites·16 claims
- 2896US7589408B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 15, 2009·59 cites·20 claims
- 2996US7550832B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 23, 2009·56 cites·13 claims
- 3096US7279784B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 9, 2007·55 cites·11 claims
- 3196US7061079B2Chip package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 13, 2006·144 cites·19 claims
- 3296US7015571B2Multi-chips module assembly packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 21, 2006·105 cites·21 claims
- 3396US6680529B2Semiconductor build-up packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 20, 2004·154 cites·19 claims
- 3496US6528882B2Thermal enhanced ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·151 cites·18 claims
- 3596US6528893B2Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·117 cites·10 claims
- 3696US6333562B1Multichip module having stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Dec 25, 2001·137 cites·15 claims
- 3796US6291271B1Method of making semiconductor chip packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Sep 18, 2001·220 cites·18 claims
- 3896US6261864B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 17, 2001·124 cites·14 claims
- 3996US6258626B1Method of making stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 10, 2001·152 cites·16 claims
- 4096US6252305B1Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 26, 2001·137 cites·2 claims
- 4195US12431453B2Electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Sep 30, 2025·2 cites·20 claims
- 4295US11892346B2Optical system and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 6, 2024·2 cites·6 claims
- 4395US11798890B2Assembly structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 24, 2023·2 cites·6 claims
- 4495US11626360B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 4595US11538760B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 27, 2022·3 cites·16 claims
- 4695US11342282B2Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·26 claims
- 4795US11309264B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 4895US11302646B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 12, 2022·5 cites·14 claims
- 4995US11276806B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 15, 2022·4 cites·22 claims
- 5095US11127650B2Semiconductor device package including thermal dissipation element and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 21, 2021·8 cites·19 claims
Showing the top 50 of 2,315 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →