Assignee
ANAM IND CO LTD
KR·19 granted patents·1,100 citations·filing 1995–1997
Top patents by PatentIndex Score
19 records- 0195US5915169ASemiconductor chip scale package and method of producing suchANAM IND CO LTD·Filed 1996·Granted Jun 22, 1999·197 cites·18 claims
- 0292US5641946AMethod and circuit board structure for leveling solder balls in ball grid array semiconductor packagesANAM IND CO LTD·Filed 1996·Granted Jun 24, 1997·129 cites·20 claims
- 0391USD394042SSwitchANAM IND CO LTD·Filed 1996·Granted May 5, 1998·57 cites·1 claims
- 0489US5767446APrinted circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor packageANAM IND CO LTD·Filed 1996·Granted Jun 16, 1998·116 cites·10 claims
- 0587US5708567ABall grid array semiconductor package with ring-type heat sinkANAM IND CO LTD·Filed 1996·Granted Jan 13, 1998·95 cites·8 claims
- 0686USD407695SRemote controlled device for controlling a switchANAM IND CO LTD·Filed 1996·Granted Apr 6, 1999·40 cites·1 claims
- 0784USD401911SRemote controlled device for controlling a switchANAM IND CO LTD·Filed 1996·Granted Dec 1, 1998·34 cites·1 claims
- 0881US5807768AMethod for fabricating a heat sink-integrated semiconductor packageANAM IND CO LTD·Filed 1996·Granted Sep 15, 1998·65 cites·9 claims
- 0980US5740956ABonding method for semiconductor chipsANAM IND CO LTD·Filed 1995·Granted Apr 21, 1998·86 cites·5 claims
- 1076US5838951AWafer map conversion methodANAM IND CO LTD·Filed 1996·Granted Nov 17, 1998·85 cites·13 claims
- 1172USD408792SSwitchANAM IND CO LTD·Filed 1996·Granted Apr 27, 1999·19 cites·1 claims
- 1272US5661338AChip mounting plate construction of lead frame for semiconductor packageANAM IND CO LTD·Filed 1995·Granted Aug 26, 1997·51 cites·7 claims
- 1369US5629561ASemiconductor package with integral heat dissipatorANAM IND CO LTD·Filed 1995·Granted May 13, 1997·38 cites·7 claims
- 1462US5641987AHeat spreader suitable for use in semiconductor packages having different pad sizesANAM IND CO LTD·Filed 1995·Granted Jun 24, 1997·31 cites·5 claims
- 1544US5712570AMethod for checking a wire bond of a semiconductor packageANAM IND CO LTD·Filed 1995·Granted Jan 27, 1998·23 cites·8 claims
- 1639US5637273AMethod for molding of integrated circuit packageANAM IND CO LTD·Filed 1996·Granted Jun 10, 1997·19 cites·11 claims
- 1732US5760498APower drawing circuit for two-wire switching unitANAM IND CO LTD·Filed 1996·Granted Jun 2, 1998·5 cites·1 claims
- 1825US5894008AMethod for manufacturing an alumina-silicon carbide nanocompositeANAM IND CO LTD·Filed 1997·Granted Apr 13, 1999·3 cites·4 claims
- 1923US5582772ACopper oxide-filled polymer die attach adhesive composition for semiconductor packageANAM IND CO LTD·Filed 1995·Granted Dec 10, 1996·7 cites·6 claims
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