Assignee
APPELT BERND KARL
US·4 granted patents·2 pending applications·35 citations·filing 2008–2011
Top patents by PatentIndex Score
6 records- 0191US8304878B2Embedded component substrate, semiconductor package structure using the same and fabrication methods thereofAPPELT BERND KARL·Filed 2010·Granted Nov 6, 2012·16 cites·19 claims
- 0284US8399776B2Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and packageAPPELT BERND KARL·Filed 2009·Granted Mar 19, 2013·16 cites·40 claims
- 0368US8104171B2Method of fabricating multi-layered substrateAPPELT BERND KARL·Filed 2008·Granted Jan 31, 2012·2 cites·13 claims
- 0460US8309400B2Leadframe package structure and manufacturing method thereofAPPELT BERND KARL·Filed 2010·Granted Nov 13, 2012·1 cites·21 claims
- 0548US2012073871A1Multi-layered substrateAPPELT BERND KARL·Filed 2011·Application pending·0 cites
- 0639US2012261689A1Semiconductor device packages and related methodsAPPELT BERND KARL·Filed 2011·Application pending·0 cites
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