Multi-layered substrate

Abstract

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

1 . A multi-layered substrate structure, comprising:
 a base having a top surface, a bottom surface, and at least a through-hole passing through the base;   a patterned first metal layer formed on the bottom surface of the base;   a patterned second metal layer formed on the top surface of the base;   a first plating layer covering a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole; and   a second plating layer covering the first plating layer and the top surface surrounding a top opening of the through hole.   
     
     
         2 . The structure as claimed in  claim 1 , further comprising a solder mask layer over the patterned first metal layer. 
     
     
         3 . The structure as claimed in  claim 1 , further comprising a solder mask layer over the patterned second metal layer. 
     
     
         4 . The structure as claimed in  claim 1 , wherein the patterned first metal layer comprises a copper layer and a Ni/Au layer located on the copper layer. 
     
     
         5 . The structure as claimed in  claim 1 , wherein the patterned second metal layer comprises a copper layer and a Ni/Au layer located on the copper layer. 
     
     
         6 . The structure as claimed in  claim 1 , wherein a material of the base is a resin material. 
     
     
         7 . A multi-layered substrate structure, comprising:
 a base having a top surface, a bottom surface, and at least a through-hole passing through the base;   a patterned first metal layer formed on the bottom surface of the base;   a patterned second metal layer formed on the top surface of the base;   a first plating layer having a first portion covering an sidewall of the through-hole entirely and a second portion covering the bottom surface surrounding a bottom opening of the through hole; and   a second plating layer having a third portion covering the entire first portion of the first plating layer and a fourth portion covering the top surface surrounding a top opening of the through hole, wherein the entire sidewall of the through-hole is covered by the first and third portions and corners of the through-hole are covered by both of the first and second plating layers.   
     
     
         8 . The structure as claimed in  claim 7 , further comprising a solder mask layer over the patterned first metal layer. 
     
     
         9 . The structure as claimed in  claim 7 , further comprising a solder mask layer over the patterned second metal layer. 
     
     
         10 . The structure as claimed in  claim 7 , wherein the patterned first metal layer comprises a copper layer and a Ni/Au layer located on the copper layer. 
     
     
         11 . The structure as claimed in  claim 7 , wherein the patterned second metal layer comprises a copper layer and a Ni/Au layer located on the copper layer. 
     
     
         12 . The structure as claimed in  claim 7 , wherein a material of the base is a resin material.