Inventor · disambiguated record
You-Lung Yen
Also filed as: YEN YOU-LUNG
40 granted patents·8 pending applications·41 citations·filing 2008–2025
95Inventor score
Top patents by PatentIndex Score
48 records- 0197US11682656B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 20, 2023·4 cites·18 claims
- 0293US11791245B2Electronic package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 17, 2023·2 cites·18 claims
- 0393US10217728B2Semiconductor package and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 26, 2019·11 cites·47 claims
- 0487US11482480B2Package substrate including an optically-cured dielecetric layer and method for manufacturing the package substrateADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 25, 2022·2 cites·21 claims
- 0586US11322428B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 3, 2022·4 cites·12 claims
- 0684US12009317B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 11, 2024·1 cites·9 claims
- 0783US10181438B2Semiconductor substrate mitigating bridgingADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jan 15, 2019·4 cites·26 claims
- 0881US11545406B2Substrate structure, semiconductor package structure and method for manufacturing a substrate structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 3, 2023·1 cites·8 claims
- 0979US11145624B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 12, 2021·2 cites·21 claims
- 1078US10978312B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 13, 2021·2 cites·45 claims
- 1176US10128198B2Double side via last method for double embedded patterned substrateADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 13, 2018·2 cites·18 claims
- 1275US9659853B2Double side via last method for double embedded patterned substrateADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 23, 2017·2 cites·11 claims
- 1372US11282777B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 22, 2022·1 cites·23 claims
- 1472US2025246514A1Electronic package and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1570US2022359361A1Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1668US11574856B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 1768US8104171B2Method of fabricating multi-layered substrateAPPELT BERND KARL·Filed 2008·Granted Jan 31, 2012·2 cites·13 claims
- 1864US12283537B2Electronic package and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 22, 2025·0 cites·16 claims
- 1962US11735433B2Substrate structure, package structure and method for manufacturing electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 22, 2023·0 cites·18 claims
- 2061US10079156B2Semiconductor package including dielectric layers defining via holes extending to component padsADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 18, 2018·1 cites·16 claims
- 2160US12198999B2Electronic package including a protection layerADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 14, 2025·0 cites·18 claims
- 2260US12002729B2Electronic package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 4, 2024·0 cites·18 claims
- 2359US11398421B2Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 26, 2022·0 cites·20 claims
- 2458US11961831B2Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2558US11705401B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 18, 2023·0 cites·14 claims
- 2658US2025029951A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2757US11830799B2Semiconductor device package, antenna device, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 28, 2023·0 cites·16 claims
- 2857US11322468B2Semiconductor device including metal holder and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 2956US11664301B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 3056US2024355793A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3155US11881448B2Semiconductor package structure having substrate with embedded electronic component and conductive pillarsADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 23, 2024·0 cites·17 claims
- 3255US11830798B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 28, 2023·0 cites·9 claims
- 3355US11631633B2Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 18, 2023·0 cites·9 claims
- 3454US11610834B2Leadframe including conductive pillar over land of conductive layerADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 21, 2023·0 cites·11 claims
- 3554US11462484B2Electronic package with wettable flank and shielding layer and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 4, 2022·0 cites·13 claims
- 3653US11664339B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 30, 2023·0 cites·12 claims
- 3752US12002743B2Electronic carrier and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 4, 2024·0 cites·5 claims
- 3852US11616007B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 28, 2023·0 cites·18 claims
- 3951US11322454B2Semiconductor device packages and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 3, 2022·0 cites·15 claims
- 4051US2019363039A1Semiconductor package and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 4150US11791281B2Package substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 17, 2023·0 cites·13 claims
- 4250US9583427B2Semiconductor substrate, semiconductor package structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 4350US2022336332A1Conductive structure, package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 4449US10755994B2Semiconductor package structure and semiconductor substrateADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
- 4548US9373601B2Semiconductor substrate, semiconductor package structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 21, 2016·0 cites·20 claims
- 4648US2012073871A1Multi-layered substrateAPPELT BERND KARL·Filed 2011·Application pending·0 cites
- 4742US10643863B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 5, 2020·0 cites·23 claims
- 4840US2019279924A1Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →