Inventor · disambiguated record
Yuan-Chang Su
Also filed as: SU YUAN · SU YUAN-CHANG
32 granted patents·8 pending applications·328 citations·filing 1999–2022
97Inventor score
Top patents by PatentIndex Score
40 records- 0196US9406658B2Embedded component device and manufacturing methods thereofLEE CHUN-CHE·Filed 2010·Granted Aug 2, 2016·107 cites·16 claims
- 0295US8569894B2Semiconductor package with single sided substrate design and manufacturing methods thereofSU YUAN-CHANG·Filed 2011·Granted Oct 29, 2013·27 cites·29 claims
- 0395US8320134B2Embedded component substrate and manufacturing methods thereofSU YUAN-CHANG·Filed 2010·Granted Nov 27, 2012·35 cites·20 claims
- 0494US9372892B1Bloom filter construction method for use in a table join operation portion of processing a query to a distributed databaseIBM·Filed 2015·Granted Jun 21, 2016·19 cites·1 claims
- 0592US9501527B1Bloom filter construction method for use in a table join operation portion of processing a query to a distributed databaseIBM·Filed 2016·Granted Nov 22, 2016·12 cites·1 claims
- 0692US8284561B2Embedded component package structureSU YUAN-CHANG·Filed 2010·Granted Oct 9, 2012·16 cites·19 claims
- 0791US8884424B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·12 cites·17 claims
- 0889US8288869B2Semiconductor package with substrate having single metal layer and manufacturing methods thereofHUANG SHIH-FU·Filed 2010·Granted Oct 16, 2012·15 cites·20 claims
- 0988US8367473B2Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·12 cites·18 claims
- 1085US9420695B2Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 16, 2016·6 cites·17 claims
- 1185US8786062B2Semiconductor package and process for fabricating sameSU YUAN-CHANG·Filed 2010·Granted Jul 22, 2014·8 cites·6 claims
- 1284US8399776B2Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and packageAPPELT BERND KARL·Filed 2009·Granted Mar 19, 2013·16 cites·40 claims
- 1383US10181438B2Semiconductor substrate mitigating bridgingADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jan 15, 2019·4 cites·26 claims
- 1476US10128198B2Double side via last method for double embedded patterned substrateADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 13, 2018·2 cites·18 claims
- 1576US9117697B2Semiconductor substrate and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 25, 2015·4 cites·20 claims
- 1675US10096542B2Substrate, semiconductor package structure and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 9, 2018·2 cites·21 claims
- 1775US9659853B2Double side via last method for double embedded patterned substrateADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 23, 2017·2 cites·11 claims
- 1871US9196597B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 24, 2015·2 cites·18 claims
- 1971US8330267B2Semiconductor packageCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 11, 2012·5 cites·20 claims
- 2070US2022359361A1Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 2169US9165900B2Semiconductor package and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Oct 20, 2015·2 cites·20 claims
- 2268US8104171B2Method of fabricating multi-layered substrateAPPELT BERND KARL·Filed 2008·Granted Jan 31, 2012·2 cites·13 claims
- 2367US9564346B2Package carrier, semiconductor package, and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 7, 2017·1 cites·20 claims
- 2463US8357861B2Circuit board, and chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 22, 2013·2 cites·14 claims
- 2561US10079156B2Semiconductor package including dielectric layers defining via holes extending to component padsADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 18, 2018·1 cites·16 claims
- 2660US8309400B2Leadframe package structure and manufacturing method thereofAPPELT BERND KARL·Filed 2010·Granted Nov 13, 2012·1 cites·21 claims
- 2759US11398421B2Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 26, 2022·0 cites·20 claims
- 2857US2010300331A1Computer desk with a drawer connected with elbow support boardsSU YUAN·Filed 2008·Application pending·0 cites
- 2954US2010295431A1Writing desk of drawer connecting with the arms support boardSU YUAN·Filed 2007·Application pending·0 cites
- 3052US2019088506A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 3150US10083902B2Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 25, 2018·0 cites·21 claims
- 3250US9583427B2Semiconductor substrate, semiconductor package structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 3349US6353997B1Layer build-up method for manufacturing multi-layer boardSUBTRON TECHNOLOGY CO LTD·Filed 1999·Granted Mar 12, 2002·13 cites·34 claims
- 3448US9373601B2Semiconductor substrate, semiconductor package structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 21, 2016·0 cites·20 claims
- 3548US2012073871A1Multi-layered substrateAPPELT BERND KARL·Filed 2011·Application pending·0 cites
- 3646US10325842B2Substrate for packaging a semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 3746US2011084372A1Package carrier, semiconductor package, and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
- 3845US2016218021A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
- 3944US10424547B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 24, 2019·0 cites·14 claims
- 4035US2010289132A1Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and packageHUANG SHIH-FU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →